인터페이스 RS-232 트랜시버

SN75C1154

활성

쿼드러플 저전력 드라이버/리시버

제품 상세 정보

Drivers per package 4 Receivers per package 4 Logic voltage (min) (V) 5 Data rate (max) (Mbps) 0.095 Main supply voltage (nom) (V) 5 ESD HBM (kV) 0 Rating Catalog Operating temperature range (°C) 0 to 70 Vout (typ) (V) 10.7
Drivers per package 4 Receivers per package 4 Logic voltage (min) (V) 5 Data rate (max) (Mbps) 0.095 Main supply voltage (nom) (V) 5 ESD HBM (kV) 0 Rating Catalog Operating temperature range (°C) 0 to 70 Vout (typ) (V) 10.7
PDIP (N) 20 228.702 mm² 24.33 x 9.4 SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Meet or Exceed the Requirements of TIA/EIA-232-F and ITU Recommendation V.28
  • Very Low Power Consumption . . .5 mW Typ
  • Wide Driver Supply Voltage . . .±4.5 V to ±15 V
  • Driver Output Slew Rate Limited to 30 V/µs Max
  • Receiver Input Hysteresis . . . 1000 mV Typ
  • Push-Pull Receiver Outputs
  • On-Chip Receiver 1-µs Noise Filter

  • Meet or Exceed the Requirements of TIA/EIA-232-F and ITU Recommendation V.28
  • Very Low Power Consumption . . .5 mW Typ
  • Wide Driver Supply Voltage . . .±4.5 V to ±15 V
  • Driver Output Slew Rate Limited to 30 V/µs Max
  • Receiver Input Hysteresis . . . 1000 mV Typ
  • Push-Pull Receiver Outputs
  • On-Chip Receiver 1-µs Noise Filter

The SN65C1164 and SN75C1154 are low-power BiMOS devices containing four independent drivers and receivers that are used to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). These devices are designed to conform to TIA/EIA-232-F. The drivers and receivers of the SN65C1154 and SN75C1154 are similar to those of the SN75C188 quadruple driver and SN75C189A quadruple receiver, respectively. The drivers have a controlled output slew rate that is limited to a maximum of 30 V/µs and the receivers have filters that reject input noise pulses of shorter than 1 µs. Both these features eliminate the need for external components.

The SN65C1154 and SN75C1154 have been designed using low-power techniques in a BiMOS technology. In most applications, the receivers contained in these devices interface to single inputs of peripheral devices such as ACEs, UARTs, or microprocessors. By using sampling, such peripheral devices usually are insensitive to the transition times of the input signals. If this is not the case, or for other uses, it is recommended that the SN65C1154 and SN75C1154 receiver outputs be buffered by single Schmitt input gates or single gates of the HCMOS, ALS, or 74F logic families.

The SN65C1164 and SN75C1154 are low-power BiMOS devices containing four independent drivers and receivers that are used to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). These devices are designed to conform to TIA/EIA-232-F. The drivers and receivers of the SN65C1154 and SN75C1154 are similar to those of the SN75C188 quadruple driver and SN75C189A quadruple receiver, respectively. The drivers have a controlled output slew rate that is limited to a maximum of 30 V/µs and the receivers have filters that reject input noise pulses of shorter than 1 µs. Both these features eliminate the need for external components.

The SN65C1154 and SN75C1154 have been designed using low-power techniques in a BiMOS technology. In most applications, the receivers contained in these devices interface to single inputs of peripheral devices such as ACEs, UARTs, or microprocessors. By using sampling, such peripheral devices usually are insensitive to the transition times of the input signals. If this is not the case, or for other uses, it is recommended that the SN65C1154 and SN75C1154 receiver outputs be buffered by single Schmitt input gates or single gates of the HCMOS, ALS, or 74F logic families.

다운로드

관심 가지실만한 유사 제품

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비교 대상 장치와 유사한 기능
TRS208 활성 +/-9V 출력 및 +/-15kV ESD 보호를 지원하는 5V 쿼드 채널 120kbps RS-232 라인 드라이버/리시버 Improved 15kV HBM

기술 자료

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* Data sheet SN65C1154, SN75C1154 datasheet (Rev. D) 2003/04/01

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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