SN75LVDS9638
- Meets or Exceeds the Requirements of ANSI TIA/EIA-644 Standard
- Low-Voltage Differential Signaling With Typical Output Voltage of 350 mV and a 100- Load
- Signaling Rates up to 155 Mbps
- Operates From a Single 3.3-V Supply
- Driver at High Impedance When Disabled or With VCC = 0
- Low-Voltage TTL (LVTTL) Logic Input Levels
- Characterized For Operation From 0°C to 70°C
The SN75LVDS31 and SN75LVDS9638 are differential line drivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.
The intended application of these devices and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN75LVDS31 and SN75LVDS9638 are characterized for operation from 0°C to 70°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | High-Speed Differential Line Drivers datasheet (Rev. C) | 2001/06/22 | |
Application brief | LVDS to Improve EMC in Motor Drives | 2018/09/27 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018/08/03 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018/05/16 | ||
Application note | An Overview of LVDS Technology | 1998/10/05 |
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치