THVD2412
- Meets or exceeds the requirements of the TIA/EIA-485A and TIA/EIA-422B standards
- 3V to 5.5V supply voltage
- Differential output exceeds 2.1V for PROFIBUS compatibility with 5V supply
- Bus I/O protection
- ±70V DC bus fault
- ±16kV HBM ESD
- ±8kV IEC 61000-4-2 contact discharge
- ±8kV IEC 61000-4-2 air-gap discharge
- ±4kV IEC 61000-4-4 fast transient burst
- Full-duplex devices available in two speed grades
- THVD2412: 250kbps
- THVD2442: 20Mbps
- Extended ambient temperature range: -40°C to 125°C
- Extended operational common-mode range: ±25V
- Enhanced receiver hysteresis for noise immunity
- Low power consumption
- Low shutdown supply current: < 10µA
- Current during operation: < 5.6mA
- Glitch-free power-up/down for hot plug-in capability
- Open, short, and idle bus failsafe
- Thermal shutdown
- 1/8 unit load (up to 256 bus nodes) in - 7V to 12V common mode range
- Small 3mm x 3mm VSON package to save board space
THVD2412 and THVD2442 are ±70V fault-protected, full-duplex, RS-422/RS-485 transceivers operating on a single 3V to 5.5V supply. Bus interface pins are protected against overvoltage conditions during all modes of operation ensuring robust communication in rugged industrial environments.
These devices feature integrated IEC ESD protection, eliminating the need for external system-level protection components. Extended ±25V input common-mode range ensures reliable data communication over longer cable run lengths and/or in the presence of large ground loop voltages. Enhanced 250mV receiver hysteresis provides high noise rejection. In addition, the receiver fail-safe feature provides a logic high when the bus inputs are open or shorted together.
THVD24x2 devices are available in small and thermally efficient VSON packages for space-constrained applications. These devices are characterized over ambient temperature from –40°C to 125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | THVD24x2 ±70V Fault-Protected 3V to 5.5V Full Duplex RS-485 Transceivers With IEC ESD datasheet (Rev. A) | PDF | HTML | 2024/03/05 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치