인터페이스 SBC(시스템 기반 칩)

TLIN1028S-Q1

활성

전압 레귤레이터가 통합된 오토모티브 LIN(로컬 상호 연결 네트워크) 트랜시버

제품 상세 정보

Protocols LIN, SBC Number of channels 1 Supply voltage (V) 5 to 28 Bus fault voltage (V) -58 to 58 Signaling rate (max) (bps) 100000 Rating Automotive
Protocols LIN, SBC Number of channels 1 Supply voltage (V) 5 to 28 Bus fault voltage (V) -58 to 58 Signaling rate (max) (bps) 100000 Rating Automotive
  • AEC-Q100 (Grade 1) : Qualified for automotive applications
  • Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN (See SLLA495)
  • Functional Safety-Capable
  • Supports 12-V applications
  • Wide operating ranges
    • ±58 V LIN bus fault protection
    • LDO output supporting 3.3 V or 5 V
    • Sleep mode: Ultra-low current consumption allows wake-up event from:
      • LIN bus or local wake through EN pin
    • Power-up and down glitch-free operation
  • Protection features:
    • ESD protection, VSUP under-voltage protection
    • TXD dominant time out (DTO) protection, Thermal shutdown
    • Unpowered node or ground disconnection fail-safe at system level
  • VCC sources up to 70 mA
  • Available in SOIC (8) package
  • AEC-Q100 (Grade 1) : Qualified for automotive applications
  • Local interconnect network (LIN) physical layer specification ISO/DIS 17987–4 compliant and conforms to SAE J2602 recommended practice for LIN (See SLLA495)
  • Functional Safety-Capable
  • Supports 12-V applications
  • Wide operating ranges
    • ±58 V LIN bus fault protection
    • LDO output supporting 3.3 V or 5 V
    • Sleep mode: Ultra-low current consumption allows wake-up event from:
      • LIN bus or local wake through EN pin
    • Power-up and down glitch-free operation
  • Protection features:
    • ESD protection, VSUP under-voltage protection
    • TXD dominant time out (DTO) protection, Thermal shutdown
    • Unpowered node or ground disconnection fail-safe at system level
  • VCC sources up to 70 mA
  • Available in SOIC (8) package

The TLIN1028S-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The LIN receiver supports data rates up to 100 kbps for end-of-line programming. The TLIN1028S-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin. The TLIN1028S-Q1 reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA of current to power microprocessors, sensors or other devices. The TLIN1028S-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME).

The TLIN1028S-Q1 is a local interconnect network (LIN) physical layer transceiver, compliant to LIN 2.2A ISO/DIS 17987–4 standards, with an integrated low dropout (LDO) voltage regulator.

LIN is a single-wire bidirectional bus typically used for low speed in-vehicle networks using data rates up to 20 kbps. The LIN receiver supports data rates up to 100 kbps for end-of-line programming. The TLIN1028S-Q1 converts the LIN protocol data stream on the TXD input into a LIN bus signal. The receiver converts the data stream to logic-level signals that are sent to the microprocessor through the open-drain RXD pin. The TLIN1028S-Q1 reduces system complexity by providing a 3.3 V or 5 V rail with up to 70 mA of current to power microprocessors, sensors or other devices. The TLIN1028S-Q1 has an optimized current-limited wave-shaping driver which reduces electromagnetic emissions (EME).

다운로드

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
2개 모두 보기
유형 직함 날짜
* Data sheet TLIN1028S-Q1 Automotive 70-mA System Basis Chip (SBC) datasheet (Rev. B) PDF | HTML 2022/05/31
* Errata TLIN1028S-Q1 Duty Cycle Over VSUP 2020/05/22

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상