TLVM365R15
- Functional Safety-Capable
- Versatile synchronous buck DC/DC module:
- Integrated MOSFETs, inductor, and controller
- 3-V to 65-V wide input voltage range
- Up to 70-V input transient
- –40°C to +125°C junction temperature range
- 4.5-mm × 3.5-mm × 2-mm overmolded package
- Frequency adjustable from 200 kHz to 2.2 MHz using the RT pin
- Output voltage and current options:
- Fixed output variants of 3.3-V or 5-V VOUT
- Adjustable output voltage from 1 V to 6 V
- Inherent protection features for robust design
- Precision enable input and open-drain PGOOD indicator for control, sequencing, and VIN UVLO
- Overcurrent and thermal shutdown protections
- Designed for scalable industrial power supplies:
- Create a custom design using the TLVM365R15 with the WEBENCH Power Designer
The TLVM365R15 and TLVM365R1 are 150-mA or 100-mA, 65-V input, synchronous step-down DC/DC power modules that combine power MOSFETs, integrated inductor, and boot capacitor in a compact and easy-to-use 3.5-mm × 4.5-mm × 2-mm, 11-pin QFN package. The small HotRod™ QFN package technology enhances the thermal performance and low EMI. The device features the ultra-low operating IQ of 4 µA at no load (24-V to 3.3-V VOUT). The TLVM365R15 and TLVM365R1 support fixed 3.3-V and 5-V outputs, as well as adjustable output voltages ranging from 1 V to 6 V. The devices only require four external components for a 3.3-V and 5-V fixed output design. The TLVM365R15 and TLVM365R1 are designed for excellent EMI performance and space constraint applications.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TLVM365R1x 3-V to 65-V, 100-mA and 150-mA Wide VIN Synchronous Buck Converter Power Module Optimized for Size and Light Load Efficiency datasheet | PDF | HTML | 2023/12/15 |
| Functional safety information | TLVM365R1x 3-V to 65-V, 100-mA and 150-mA Wide VIN Synchronous Buck Converter Po | PDF | HTML | 2023/12/08 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| QFN-FCMOD (RDN) | 11 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치