TPS3619-33-EP
- Supply Current of 40 µA (Max)
- Battery-Supply Current of 100 nA (Max)
- Precision Supply-Voltage Monitor 3.3 V, 5 V, and Other Options on Request
- Backup-Battery Voltage Can Exceed VDD
- Power-On Reset Generator with Fixed 100-ms Reset Delay Time
- Voltage Monitor for Power-Fail or Low-Battery Monitoring
- Battery Freshness Seal (TPS3619)
- Pin-to-Pin Compatible With MAX819, MAX703, and MAX704
- 8-Pin Mini Small-Outline Package (MSOP) Package
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
- APPLICATIONS
- Fax Machines
- Set-Top Boxes
- Advanced Voice-Mail Systems
- Portable Battery-Powered Equipment
- Computer Equipment
- Advanced Modems
- Automotive Systems
- Portable Long-Time Monitoring Equipment
- Point-of-Sale Equipment
(1) Additional temperature ranges available - contact factory
The TPS3619 and TPS3620 families of supervisory circuits monitor and control processor activity by providing backup-battery switchover for data retention of CMOS RAM.
During power on, RESET is asserted when the supply voltage (VDD or VBAT) becomes higher than 1.1 V. Thereafter, the supply voltage supervisor monitors VDD and keeps RESET output active as long as VDD remains below the threshold voltage (VIT). An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time starts after VDD has risen above VIT. When the supply voltage drops below VIT, the output becomes active (low) again.
The product spectrum is designed for supply voltages of 3.3 V and 5 V. The TPS3619 and TPS3620 are available in an 8-pin MSOP package and are characterized for operation over a temperature range of –55°C to 125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPS3619-33-EP, TPS3619-50-EP, TPS3620-33-EP, TPS3620-50-EP datasheet (Rev. C) | 2010/09/24 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치