TPS51624
- Intel VR12.6 PWM Specification serial VID (SVID) compliant
- 1- or 2-phase operation
- Full VR12.6 mobile feature set including digital current monitor, PS3 and PS4 operation
- 8-Bit DAC with 0.50-V to 2.30-V output range
- Optimized efficiency at light and heavy loads
- 8 independent levels of overshoot reduction (OSR) and undershoot reduction (USR)
- Driverless configuration for efficient high-frequency switching
- Supports discrete, power block, Power Stage or DrMOS MOSFET implementations
- Accurate, adjustable voltage positioning
- 300-kHz to 1.5-MHz frequency selections
- Patented AutoBalance phase balancing
- Selectable 8-level current limit
- 4.5-V to 28-V conversion voltage range
- Small, 4 × 4, 32-pin, QFN PowerPAD™ integrated circuit package
The TPS51624 is a driverless, fully SVID compliant, VR12.6 step-down controller. Advanced control features such as D-CAP+ architecture with overlapping pulse support undershoot reduction (USR) and overshoot reduction (OSR) provide fast transient response, lowest output capacitance and high efficiency. The TPS51624 also supports single-phase operation in CCM or DCM for light-load efficiency. The TPS51624 integrates the full complement of VR12.6 I/O features including VR_READY (PGOOD), ALERT and VR_HOT. The SVID interface address allows programming from 0 to 7. In PS4, the quiescent power consumption of controller is typical 0.25 mW. Adjustable control of VCPU slew rate and voltage positioning round out the VR12.6 features. Paired with the new TPS51604 FET gate driver, the solution delivers exceptionally high speed and low switching loss. The TPS51624 works with selected TI Power Stage™ products for optimum efficiency as well as DrMOS products.
The TPS51624 package is a space saving, thermally enhanced 32-pin QFN that operates from -40°C to 105°C.
특별 참고 사항
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기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPS51624 Short datasheet | 2022/04/13 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VQFN (RSM) | 32 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치