홈 전원 관리 AC/DC 및 DC/DC 컨트롤러(외장 FET)
홈
전원 관리
AC/DC 및 DC/DC 컨트롤러(외장 FET)

TPS53685

활성

AMD 플랫폼용 SVI3 및 PMBus를 지원하는 8상, 디지털 스텝다운 다중 위상 컨트롤러

지금 주문
데이터 시트

TPS53685

활성
데이터 시트 지금 주문

제품 상세 정보

Vin (min) (V) 4.5 Vin (max) (V) 17 Iout (max) (A) 765 Operating temperature range (°C) -40 to 105 Control mode D-CAP+ Topology Multiphase Rating Catalog Vout (min) (V) 0.25 Vout (max) (V) 5.5 Features Adjustable current limit, Dynamic Voltage Scaling, Enable, Light Load Efficiency, Multiple Outputs, Output discharge, PMBus, Phase Interleaving, Power good, Pre-Bias Start-Up, Remote Sense, Synchronous Rectification, UVLO adjustable, Voltage Margining Iq (typ) (µA) 60000 Number of phases 8
Vin (min) (V) 4.5 Vin (max) (V) 17 Iout (max) (A) 765 Operating temperature range (°C) -40 to 105 Control mode D-CAP+ Topology Multiphase Rating Catalog Vout (min) (V) 0.25 Vout (max) (V) 5.5 Features Adjustable current limit, Dynamic Voltage Scaling, Enable, Light Load Efficiency, Multiple Outputs, Output discharge, PMBus, Phase Interleaving, Power good, Pre-Bias Start-Up, Remote Sense, Synchronous Rectification, UVLO adjustable, Voltage Margining Iq (typ) (µA) 60000 Number of phases 8
WQFN (RSB) 40 25 mm² 5 x 5
  • Input voltage range: 4.5 V to 17 V
  • Output voltage range: 0.25 V to 5.5 V
  • Dual output supporting N+M ≤ 8 phases, M ≤ 4 phases
  • Native trans-inductor voltage regulator (TLVR) topology support
  • AMD SVI3 compliant
  • Enhanced D-CAP+™ control to provide superior transient performance with excellent dynamic current sharing
  • Programmable loop compensations
  • Flexible phase-firing sequencing
  • Individual phase current calibrations and reports
  • Dynamic phase shedding with programmable current threshold for optimizing efficiency at light and heavy loads
  • Fast phase-adding for undershoot reduction
  • Driverless configuration for efficient high-frequency switching
  • Fully compatible with TI NexFET™ power stages for high-density solutions
  • Accurate, adjustable voltage positioning
  • Patented AutoBalance™ phase current balancing
  • Selectable per-phase current limit
  • PMBus™ system interface for telemetry of voltage, current, power, temperature, and fault conditions
  • 5.00 × 5.00 mm, 40-pin, 0.4 mm pitch, QFN package
  • Input voltage range: 4.5 V to 17 V
  • Output voltage range: 0.25 V to 5.5 V
  • Dual output supporting N+M ≤ 8 phases, M ≤ 4 phases
  • Native trans-inductor voltage regulator (TLVR) topology support
  • AMD SVI3 compliant
  • Enhanced D-CAP+™ control to provide superior transient performance with excellent dynamic current sharing
  • Programmable loop compensations
  • Flexible phase-firing sequencing
  • Individual phase current calibrations and reports
  • Dynamic phase shedding with programmable current threshold for optimizing efficiency at light and heavy loads
  • Fast phase-adding for undershoot reduction
  • Driverless configuration for efficient high-frequency switching
  • Fully compatible with TI NexFET™ power stages for high-density solutions
  • Accurate, adjustable voltage positioning
  • Patented AutoBalance™ phase current balancing
  • Selectable per-phase current limit
  • PMBus™ system interface for telemetry of voltage, current, power, temperature, and fault conditions
  • 5.00 × 5.00 mm, 40-pin, 0.4 mm pitch, QFN package

The TPS53685 is a fully AMD SVI3 compliant step-down controller with trans-inductor voltage regulator (TLVR) topology support, dual channels, built-in non-volatile memory (NVM), PMBus™ interface, and full compatible with TI NexFET™ smart power stages. Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast transient response and good current sharing, minimizing output capacitance requirements. The device also provides a novel phase interleaving strategy and dynamic phase shedding for efficiency improvements at different loads. Adjustable control of VCORE slew rate and voltage positioning work with the AMD SVI3 features. In addition, the device supports the PMBus communication interface for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the systems. All programmable parameters can be configured by the PMBus interface and can be stored in NVM as the new default values to minimize the external component count.

The TPS53685 device is offered in a thermally enhanced 40-pin QFN packaged and is rated to operate from –40°C to 125°C.

The TPS53685 is a fully AMD SVI3 compliant step-down controller with trans-inductor voltage regulator (TLVR) topology support, dual channels, built-in non-volatile memory (NVM), PMBus™ interface, and full compatible with TI NexFET™ smart power stages. Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast transient response and good current sharing, minimizing output capacitance requirements. The device also provides a novel phase interleaving strategy and dynamic phase shedding for efficiency improvements at different loads. Adjustable control of VCORE slew rate and voltage positioning work with the AMD SVI3 features. In addition, the device supports the PMBus communication interface for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the systems. All programmable parameters can be configured by the PMBus interface and can be stored in NVM as the new default values to minimize the external component count.

The TPS53685 device is offered in a thermally enhanced 40-pin QFN packaged and is rated to operate from –40°C to 125°C.
filter 기타 AC/DC 및 DC/DC 컨트롤러(외장 FET) 찾기
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정보

추가 정보 요청

전체 데이터 시트 및 기타 정보를 사용할 수 있습니다. 지금 요청하기

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
TPS536C5 활성 AMD 플랫폼용 SVI3 및 PMBus를 지원하는 12상 디지털 스텝다운 다중 위상 컨트롤러 TPS536C5 has higher phase count of 12 compared to TPS53685 which has eight phases

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
1개 모두 보기
유형 직함 날짜
* Data sheet TPS53685 Dual-Channel (N + M ≤ 8 phase) D-CAP+, Step-Down, Multiphase Controller with AMD-SVI3 and PMBus Interfaces datasheet PDF | HTML 2022/05/31

설계 및 개발

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패키지 핀 CAD 기호, 풋프린트 및 3D 모델
WQFN (RSB) 40 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

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