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비교 대상 장치와 유사한 기능
TPS560200-Q1
- AEC-Q100 Qualified for Automotive Applications
- Temperature Range: Grade 1 -40°C to 125°C
- HBM ESD Classification: H2
- CDM ESD Classification: C4B
- Integrated Monolithic 0.95-Ω High-Side and 0.33-Ω Low-Side MOSFETs
- 500-mA Continuous Output Current
- Output Voltage Range: 0.8 V to 6.5 V
- 0.8-V Voltage Reference With ±1.3% Accuracy Over Temperature
- Auto-Skip Advanced Eco-mode™ for High Efficiency at Light Loads
- D-CAP2™ Mode Enables Fast Transient Responses
- No External Compensation Needed
- 600-kHz Switching Frequency
- 2-ms Internal Soft Start
- Safe Start-Up into Prebiased VOUT
- Thermal Shutdown
- –40°C to 125°C Operating Junction Temperature Range
- Available in 8-pin MSOP Package
The TPS560200-Q1 is an 17-V, 500-mA, low-Iq, adaptive on-time D-CAP2 mode synchronous monolithic buck converter with integrated MOSFETs in easy-to-use 8-pin MSOP package.
The TPS560200-Q1 lets system designers complete the suite of various end-equipment power bus regulators with a cost-effective, low component count and low standby current solution. The main control loop for the device uses the D-CAP2 mode control that provides a fast transient response with no external compensation components. The adaptive on-time control supports seamless transition between PWM mode at higher load conditions and advanced Eco-Mode operation at light loads.
The TPS560200-Q1 also has a proprietary circuit that enables the device to adopt to both low equivalent series resistance (ESR) output capacitors, such as POSCAP or SP-CAP, and ultra-low ESR ceramic capacitors. The device operates from 4.5-V to 17-V VIN input. The output voltage can be programmed between 0.8 V and 6.5 V. The device also features a fixed 2-ms soft-start time. The device is available in the 8-pin MSOP package.
기술 자료
설계 및 개발
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TPS560200 Unencrypted PSpice Transient Model Package (Rev. A)
TIDA-01168 — 12V/48V 오토모티브 시스템을 위한 양방향 DC/DC 컨버터 레퍼런스 디자인
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VSSOP (DGK) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치