TPS60100
- Up to 200-mA Output Current
- Less Than 5-mVpp Output Voltage Ripple
- No Inductors Required/Low EMI
- Regulated 3.3-V ±4% Output
- Only Four External Components Required
- Up to 90% Efficiency
- 1.8-V to 3.6-V Input Voltage Range
- 50-µA Quiescent Supply Current
- 0.05-µA Shutdown Current
- Load Isolated in Shutdown
- Space-Saving Thermally-Enhanced TSSOP PowerPADTM Package
- Evaluation Module Available (TPS60100EVM-131)
applications
Replaces DC/DC Converters With Inductors in
- Battery-Powered Applications
- Two Battery Cells to 3.3-V Conversion
- Portable Instruments
- Battery-Powered Microprocessor and DSP Systems
- Miniature Equipment
- Backup-Battery Boost Converters
- PDAs
- Laptops
- Handheld Instrumentation
- Medical Instruments
- Cordless Phones
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPS60100 step-up, regulated charge pump generates a 3.3-V ±4% output voltage from a 1.8-V to 3.6-V input voltage (two alkaline, NiCd, or NiMH batteries). Output current is 200 mA from a 2-V input. Only four external capacitors are needed to build a complete low-noise dc/dc converter. The push-pull operating mode of two single-ended charge pumps assures the low output voltage ripple as current is continuously transferred to the output. From a 2-V input, the TPS60100 can start into full load with loads as low as 16 Ω.
The TPS60100 features either constant frequency mode to minimize noise and output voltage ripple or the power-saving pulse-skip mode to extend battery life at light loads. The TPS60100 switching frequency is 300 kHz. The logic shutdown function reduces the supply current to 1-µA (max) and disconnects the load from the input. Special current-control circuitry prevents excessive current from being drawn from the battery during start-up. This dc/dc converter requires no inductors and has low EMI. It is available in the small 20-pin TSSOP PowerPADTM package (PWP).
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Regulated 3.3-V 200-mA Low-Noise Charge Pump DC/DC Converter datasheet (Rev. C) | 2008/08/07 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치