TPS75005
- Optimized to Supply TI’s C2000 MCU Series:
F2833x (DELFINO), F2823x, F281x, and F280x/F2801x - Dual 500-mA Voltage Regulators with Dedicated Supply
Voltage Supervisors (SVSs) - One Auxiliary SVS
- LDO1 and SVS1 for 1.8 V/1.9 V (Selectable):
±5% Specified with PG - LDO2 and SVS2 for 3.3 V:
±5% Specified with PG - Input Voltage Range: 3.75 V to 6.5 V
- Independent Soft-Start for LDO1 and LDO2
- Preset Power-Up and Power-Down Sequencing for C2000 MCUs
- Supports C2000 MCU Transient with Two
10-µF Ceramic Output Capacitors - 5-mm × 5-mm QFN Package16-Pin HTSSOP package
can be supported but minimum quantity may be required;
contact sales representative.
The TPS75005 is a complete power management solution for Texas Instruments C2000 real-time microcontrollers and other DSP, FPGA, and ASIC MCUs. The device has been tested with and meets TIs F2833x (DELFINO), F2823x, F281x, and F280x/F2801x power requirements.
All of these C2000 controllers require ±5% power-rail accuracy. With the combination of high-accuracy, low-dropout regulators (LDOs) and dedicated SVSs, the device allows for a ±5% power supply to the C2000 with a power-good (PG) signal. (For more details, see Application Report SBVA032, LDO+SVS Combined Accuracy.)
Two power outputs are controlled by an integrated sequencer circuit. A single EN logic input signal makes sure that the power-up and power-down requirements of the C2000 controllers are met. The sequencer includes a soft-start for both LDOs to avoid inrush current. A third rail monitor is provided for general-purpose monitoring (for example, to monitor input voltage).
A quick-start guide (SBVA030) is available with step-by-step instructions for connection to a C2000 controller.
The TPS75005 is available in a 5-mm × 5-mm QFN package, yielding a compact total solution size with high power dissipation capability.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Integrated MCU Power Solution for C2000 Microcontrollers datasheet (Rev. C) | 2012/04/12 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치