TPS799L
- 200-mA Low-Dropout Regulator with EN
- Multiple Output Voltage Versions Available:
- TPS799L: Fixed Outputs of 5.2 V to 6.2 V Using Innovative Factory EEPROM Programming
- TPS799L57: 5.7-V Output
- TPS799L54: 5.4-V Output
- TPS799: Output Options Less Than 5.2 V
- Inrush current Protection with EN Toggle
- Low IQ: 40 µA
- High PSRR: 66 dB at 1 kHz
- Stable with a Low-ESR, 2.0-µF Typical Output Capacitance
- Excellent Load and Line Transient Response
- 2% Overall Accuracy (Load, Line, and Temperature)
- Very Low Dropout: 100 mV
- Package: 5-Bump, Thin, 1-mm × 1.37-mm DSBGA
The TPS799L family of low-dropout (LDO), low-power linear regulators offers excellent ac performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient response are provided while consuming a very low 40 µA (typical) ground current.
The TPS799Lxx is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield a dropout voltage of typically 100 mV at a 200 mA output. The TPS799L uses a precision voltage reference and feedback loop to achieve an overall accuracy of 2% over all load, line, process, and temperature variations. The TPS799L features inrush current protection when the EN toggle is used to start the device, immediately clamping the current.
All devices are fully specified over the temperature range of TJ = –40°C to +125°C, and offered in a low-profile, die-sized ball grid array (DSBGA) package, ideal for wireless handsets and WLAN cards.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPS799XXEVM-105 — TPS799xx 평가 모듈
The TPS799xx evaluation module (EVM)is designed to help the user easily evaluate and test the operation and functionality of the TPS799xx LDO. The EVM uses 3 versions of the TPS799xx LDO (TPS79901YZU (adjustable, WCSP), TPS79928YZU (2.8 V output, WCSP) and TPS79901DDC (adjustable, SOT23). (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YZY) | 5 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치