전원 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)

TPSM63603

활성

고밀도, 3V~36V 입력, 1V~16V 출력, 3A 전원 모듈

제품 상세 정보

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 3 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 16 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Overcurrent protection, Power good, Spread Spectrum Control mode current mode Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 3 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 16 Switching frequency (min) (kHz) 200 Switching frequency (max) (kHz) 2200 EMI features Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum Features EMI Tested, Enable, Frequency synchronization, Overcurrent protection, Power good, Spread Spectrum Control mode current mode Duty cycle (max) (%) 98
B0QFN (RDH) 30 24 mm² 6 x 4
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 16 V
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz using the RT pin or an external SYNC signal
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT,1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Spread-spectrum modulation (S suffix)
    • Resistor-adjustable switch-node slew rate
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63602 (36 V, 2 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63603 with the WEBENCH Power Designer
  • Versatile synchronous buck DC/DC module
    • Integrated MOSFETs, inductor, and controller
    • Wide input voltage range of 3 V to 36 V
    • Adjustable output voltage from 1 V to 16 V
    • 4-mm × 6-mm × 1.8-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz using the RT pin or an external SYNC signal
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 93% peak efficiency at 12 VIN, 5 VOUT,1 MHz
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Spread-spectrum modulation (S suffix)
    • Resistor-adjustable switch-node slew rate
    • Constant-frequency FPWM mode of operation
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63602 (36 V, 2 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63603 with the WEBENCH Power Designer

The TPSM63603 synchronous buck power module is a highly integrated 36-V, 3-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63603 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63603 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

The TPSM63603 synchronous buck power module is a highly integrated 36-V, 3-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has pins for VIN and VOUT located at the corners of the package for optimized input and output capacitor layout placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63603 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63603 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
TLVM13630 활성 고밀도, 3V~36V 입력, 1V~16V 출력, 3A 스텝다운 전원 모듈 Reduced feature set and output voltage range.
비교 대상 장치와 유사한 기능
신규 TPSM64406 활성 고밀도, 36V, 0.8V~16V 출력, 듀얼 3A 출력 전원 모듈 Dual-output device available

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
5개 모두 보기
유형 직함 날짜
* Data sheet TPSM63603 High-Density, 3-V to 36-V Input, 1-V to 16-V Output, 3-A Power Module With Enhanced HotRod™ QFN Package datasheet (Rev. A) PDF | HTML 2021/11/19
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024/03/14
EVM User's guide TPSM63603EVM and TPSM63603SEVM Evaluation Module (Rev. A) PDF | HTML 2021/07/28
Certificate TPSM63603SEVM EU Declaration of Conformity (DoC) 2021/06/24
Certificate TPSM63603EVM EU Declaration of Conformity (DoC) 2021/03/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPSM63603EVM — TPSM63603 평가 보드 3V~36V 입력, 1V~6V, 3A 출력, 전원 모듈

TPSM63603EVM 평가 보드는 TPSM63603 전원 모듈의 작동을 평가하도록 구성됩니다. 입력 전압 범위는 3V~36V입니다. 출력 전압 범위는 1V~16V입니다. 평가 보드를 사용하면 TPSM63603 작동을 쉽게 평가할 수 있습니다.

TPSM63603SEVM 평가 보드는 TPSM63603S 확산 스펙트럼 전원 모듈의 작동을 평가하도록 구성됩니다.
사용 설명서: PDF | HTML
시뮬레이션 모델

TPSM63603 PSpice Transient Model

SLVMDO9.ZIP (430 KB) - PSpice Model
계산 툴

TPSM6360XDESIGN-CALC — TPSM6360X 제품군 전원 모듈 빠른 시작 계산기 툴

TPSM63602, TPSM63603, TPSM63604 및 TPSM63606 전원 모듈 빠른 시작 설계 툴을 시작합니다. 이 독립형 툴은 이 동기식 벅 전원 모듈 제품군에 기반한 DC/DC 벅 레귤레이터 설계를 통해 전원 공급 장치 엔지니어를 용이하게 하고 지원합니다. 따라서 사용자는 애플리케이션 요구 사항을 충족하기 위해 최적화된 설계에 신속하게 도착할 수 있습니다.
사용 설명서: PDF | HTML
사용 설명서: PDF | HTML
거버(Gerber) 파일

TPSM63603 EVM Design Files

SLVC829.ZIP (1316 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
B0QFN (RDH) 30 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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