TRSF3222E
- ESD Protection for RS-232 bus pins
- ±15-kV Human-body model (HBM)
- ±8-kV IEC 61000-4-2, Contact discharge
- ±15-kV IEC 61000-4-2, Air-gap discharge
- Meets or exceeds the requirements of TIA/EIA-232-F and ITU v.28 standards
- Operates with 3-V to 5.5-V VCC supply
- Operates up to 1000 kbit/s
- Two drivers and two receivers
- Low standby current . . . 1 µA Typ
- External capacitors . . . 4 × 0.1 µF
- Accepts 5-V logic input with 3.3-V supply
The TRSF3222E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND).
The TRSF3222E meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3222E operates at typical data signaling rates up to 1000 kbit/s and is an improved drop-in replacement for industry-popular ’3222 two-driver, two-receiver functions.
The TRSF3222E can be placed in the power-down mode by setting the power-down ( PWRDOWN) input low, which draws only 1 µA from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable ( EN) high.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiverwith ±15-kV ESD Protection datasheet (Rev. A) | PDF | HTML | 2021/08/27 |
| More literature | RS-232 IEC ESD-Protected Devices From TI (Rev. A) | 2007/07/27 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
| SSOP (DB) | 20 | Ultra Librarian |
| TSSOP (PW) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.