인터페이스 USB IC USB 리드라이버 및 멀티플렉서

TSU5511

구형

임피던스 감지 마이크로 USB 스위치를 지원하는 SP3T 스위치

제품 상세 정보

Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
Type Passive mux Function USB 2.0 USB speed (Mbps) 480 Number of channels 2 Supply voltage (max) (V) 6.7 Supply voltage (min) (V) 2.8 Ron (typ) (mΩ) 4500 Input/output voltage (min) (V) -1.3 Input/output voltage (max) (V) 3.6 Configuration 3:1 Features Audio Switch (Negative Rail Capability), Charging Capability, Click-Pop Reduction, I2C interface, Impedance Detection, UART, USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 70 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 830
DSBGA (YZP) 20 6.1875 mm² 2.25 x 2.75
  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones

  • Compatible Accessories
    • USB Data Cable
    • UART Cable
    • Charger (Dedicated Charger or Host/Hub Charger)
    • Stereo Headset With Mic
  • Integrated LDOs for VREF and Mic Bias
  • USB Path Supports USB 2.0 High Speed
  • Audio Path Provides Negative Rail Support and Click/Pop Reduction
  • Supports Factory Test Mode
  • 1.8-V Compatible I2C Interface
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance DP/DM/ID/VBUS to GND
    • ±8-kV Contact Discharge (IEC 61000-4-2)
    • ±15-kV Air Gap Discharge (IEC 61000-4-2)
  • APPLICATIONS
    • Cellular Telephones

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.

The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART.

The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged.

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유형 직함 날짜
* Data sheet SP3T SWITCH WITH IMPEDANCE DETECTION datasheet 2010/09/02

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치