UCC2804-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C TA
- Device HBM classification level 2: ±2 kV
- Device CDM classification level C5: >1000 V
- 100-µA typical starting supply current
- 500-µA typical operating supply current
- Operation up to 1 MHz
- Internal soft start
- Internal fault soft start
- Internal leading-edge blanking of the current sense signal
- 1-A totem-pole output
- 70-ns typical response from current-sense to gate drive output
- 1.5% tolerance voltage reference
- Same pinout as UC3842 and UC3842A
The UCC280x-Q1 family of high-speed, low-power integrated circuits contain all of the control and drive components required for off-line and DC-to-DC fixed frequency current-mode switching mode power supplies with minimal parts count.
These devices have the same pin configuration as the UCx84x family, and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.
The UCC280x-Q1 family offers a variety of package options, temperature range options, choice of maximum duty cycle, and choice of critical voltage levels. Lower reference parts such as the UCC2803-Q1 and UCC2805-Q1 fit best into battery-operated systems, while the higher reference and higher UVLO hysteresis of the UCC2802-Q1 and UCC2804-Q1 make these ideal choices for use in off-line power supplies.
The UCC280x-Q1 series is specified for operation from –40°C to 125°C.
관심 가지실만한 유사 제품
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | UCC280x-Q1 Low-Power BiCMOS Current-Mode PWM Controllers datasheet (Rev. D) | PDF | HTML | 2018/05/31 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
UCCX804 & UCCx813-4 TINA-TI Startup Reference Design
UCCX804 & UCCx813-4 TINA-TI Steady State Reference Design
UCCX804 & UCCx813-4 TINA-TI Transient Spice Model
UCCx804, UCCx813-4 Families PSpice Transient Model (Rev. B)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치