전원 관리 AC/DC 및 DC/DC 컨트롤러(외장 FET)

UCD74120

활성

출력 전류 모니터링을 지원하는 14V, 25A 동기형 벅 전력계

제품 상세 정보

Operating temperature range (°C) -40 to 125 Rating Catalog
Operating temperature range (°C) -40 to 125 Rating Catalog
LQFN-CLIP (RVF) 40 35 mm² 7 x 5
  • Integrates Synchronous Buck Driver and NexFET™ Power MOSFETS for High Power Density and High Efficiency
  • 25-A Output Current Capability for DSP and ASIC
  • 4.7-V to 14-V Input Voltage Range
  • Operational up to 2 MHz Switching Frequency
  • Built-In High-Side Current Protection
  • DCR Current Sensing for Overcurrent Protection and Output Current Monitoring
  • Voltage Proportional to Load Current Monitor Output
  • Tri-state PWM Input for Power Stage Shutdown
  • UVLO Housekeeping Circuit
  • Integrated Thermal Shutdown
  • 40-Pin, 5 mm x 7 mm, PQFN PowerStack™ Package
  • Integrates Synchronous Buck Driver and NexFET™ Power MOSFETS for High Power Density and High Efficiency
  • 25-A Output Current Capability for DSP and ASIC
  • 4.7-V to 14-V Input Voltage Range
  • Operational up to 2 MHz Switching Frequency
  • Built-In High-Side Current Protection
  • DCR Current Sensing for Overcurrent Protection and Output Current Monitoring
  • Voltage Proportional to Load Current Monitor Output
  • Tri-state PWM Input for Power Stage Shutdown
  • UVLO Housekeeping Circuit
  • Integrated Thermal Shutdown
  • 40-Pin, 5 mm x 7 mm, PQFN PowerStack™ Package

UCD74120 is a multi-chip module integrating a driver device and two NexFET power MOSFETs into a thermally enhanced compact, 5 mm × 7 mm, QFN package. A 25-A output current capability makes the device suitable for powering DSP and ASIC. The device is designed to complement digital or analog PWM controllers. The PWM input of the driver device is 3-state compatible. Two driver circuits provide high charge and discharge current for the high-side N-channel FET switch and the low-side N-channel FET synchronous rectifier in a synchronous buck converter.

Output current is measured and monitored by a precision current sensing amplifier that processes the voltage present across an external current sense element. The amplified signal is available for use by the PWM controller on the IMON pin. On-board comparators monitor the voltage across the high-side switch and the voltage across the external current sense element to safeguard the power stage from sudden high-current loads. Blanking delay is set for the high-side comparator by a single resistor in order to avoid false reports coincident with switching edge noise. In the even of a high-side fault or an overcurrent fault, the high-side FET is turned off and the fault flag (FLT) is asserted to alert the PWM controller.

UCD74120 is a multi-chip module integrating a driver device and two NexFET power MOSFETs into a thermally enhanced compact, 5 mm × 7 mm, QFN package. A 25-A output current capability makes the device suitable for powering DSP and ASIC. The device is designed to complement digital or analog PWM controllers. The PWM input of the driver device is 3-state compatible. Two driver circuits provide high charge and discharge current for the high-side N-channel FET switch and the low-side N-channel FET synchronous rectifier in a synchronous buck converter.

Output current is measured and monitored by a precision current sensing amplifier that processes the voltage present across an external current sense element. The amplified signal is available for use by the PWM controller on the IMON pin. On-board comparators monitor the voltage across the high-side switch and the voltage across the external current sense element to safeguard the power stage from sudden high-current loads. Blanking delay is set for the high-side comparator by a single resistor in order to avoid false reports coincident with switching edge noise. In the even of a high-side fault or an overcurrent fault, the high-side FET is turned off and the fault flag (FLT) is asserted to alert the PWM controller.

다운로드 스크립트와 함께 비디오 보기 동영상

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
3개 모두 보기
유형 직함 날짜
* Data sheet High-Current, Synchronous Buck Power Stage datasheet 2011/12/23
Selection guide Power Management Guide 2018 (Rev. R) 2018/06/25
Application note UCD74120 Power Sequence Requirement 2015/10/26

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 CAD 기호, 풋프린트 및 3D 모델
LQFN-CLIP (RVF) 40 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상