DS10CP154A
- DC - 1.5 Gbps Low Jitter, Low Skew, Low Power Operation
- Pin and SMBus Configurable, Fully Differential, Non-Blocking Architecture
- Wide Input Common Mode Range Enables DC Coupled Interface to CML or LVPECL Drivers
- LOS Circuitry Detects Open Inputs Fault Condition
- On-chip 100 Ω Input and Output Termination Minimizes Insertion and Return Losses, Reduces Component Count and Minimizes Board Space
- 8 kV ESD on LVDS I/O Pins Protects Adjoining Components
- Small 6 mm x 6 mm WQFN-40 Space Saving Package
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The DS10CP154A is a 1.5 Gbps 4x4 LVDS crosspoint switch optimized for high-speed signal routing and switching over FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The non-blocking architecture allows connections of any input to any output or outputs. The switch configuration can be accomplished via external pins or the System Management Bus (SMBus) interface. In addition, the SMBus circuitry enables the loss of signal (LOS) monitors that can inform a system of the presence of an open inputs condition (e.g. disconnected cable).
Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower return losses, reduce component count and further minimize board space.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS10CP154A 1.5 Gbps 4x4 LVDS Crosspoint Switch datasheet (Rev. C) | 2013年 4月 12日 | |
Application note | AN-1821 CPRI Repeater System (Rev. A) | 2013年 4月 26日 | ||
User guide | DS10CP154EVK User Manual | 2012年 2月 23日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RTA) | 40 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點