LMC6044
- Low Supply Current: 10 μA/Amp (Typ)
- Operates from 4.5V to 15.5V Single Supply
- Ultra Low Input Current: 2 fA (Typ)
- Rail-to-Rail Output Swing
- Input Common-Mode Range Includes Ground
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Ultra-low power consumption and low input-leakage current are the hallmarks of the LMC6044. Providing input currents of only 2 fA typical, the LMC6044 can operate from a single supply, has output swing extending to each supply rail, and an input voltage range that includes ground.
The LMC6044 is ideal for use in systems requiring ultra-low power consumption. In addition, the insensitivity to latch-up, high output drive, and output swing to ground without requiring external pull-down resistors make it ideal for single-supply battery-powered systems.
Other applications for the LMC6044 include bar code reader amplifiers, magnetic and electric field detectors, and hand-held electrometers.
This device is built with National's advanced Double-Poly Silicon-Gate CMOS process.
See the LMC6041 for a single, and the LMC6042 for a dual amplifier with these features.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMC6044 CMOS Quad Micropower Operational Amplifier datasheet (Rev. D) | 2013年 3月 22日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | AN-856 A SPICE Comp Macromodel for CMOS Op Amplifiers (Rev. C) | 2013年 5月 6日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 14 | Ultra Librarian |
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點