現在提供此產品的更新版本
功能相同,但引腳輸出與所比較的裝置不同
LMV341-Q1
- Qualified for Automotive Applications
- 2.7-V and 5-V Performance
- Rail-to-Rail Output Swing
- Input Bias Current: 1 pA Typ
- Input Offset Voltage: 0.25 mV Typ
- Low Supply Current: 100 µA Typ
- Gain Bandwidth: 1 MHz Typ
- Slew Rate: 1 V/µs Typ
- Turn-On Time From Shutdown: 5 µs Typ
- Input Referred Voltage Noise (at 10 kHz):
20 nV/Hz
The LMV341 and LMV344 devices are single and quad CMOS operational amplifiers, respectively, with low voltage, low power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias current of 1 pA (typ) and an offset voltage of 0.25 mV (typ). The single supply amplifier is designed specifically for low-voltage (2.7 V to 5 V) operation, with a wide common-mode input voltage range that typically extends from 0.2 V to 0.8 V from the positive supply rail. Additional
features are a 20-nV/Hz voltage noise at
10 kHz, 1-MHz unity-gain bandwidth, 1-V/µs slew rate, and 100-µA current consumption per channel.
An extended industrial temperature range from 40°C to 125°C makes this device suitable for automotive applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Rail-to-Rail Output CMOS Operational Amplifier datasheet (Rev. C) | 2009年 6月 13日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-00296 — 汽車車身控制模組驅動器參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
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SOT-23 (DBV) | 6 | Ultra Librarian |
SOT-SC70 (DCK) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點