LOG300
- Input range:
- LNA + log detector: 7µVP to 200mVP
- Log detector: 20µVP to 1.6VP
- Adjustable output to input slope and response time.
- Dynamic range: 98dB with log conformance error (LCE) = ±1dB
- Signal detection up to 40MHz; even higher with reduced LCE
- Input frequency detection, zero cross detect
- Supply: 3V to 5.25V
The LOG300 is an integrated Analog Front End (AFE) consisting of low-noise amplifier (LNA) and a Log Detector block. This device supports an input frequency range of up-to 40MHz and a typical dynamic range of 98dB. The LOG300 is intended for use in applications that require a wide dynamic range of voltage and signal measurement. The Log Detector block of LOG300 supports both single-ended and differential inputs. The low input noise of the integrated LNA, allows measurement of signals as low as 7µVP. The transient output response can be adjusted by tuning the capacitor connected at the Log_Out pin. The integrated frequency detect feature of LOG300 enables users to extract input signal frequency and zero-crossing information.
The LOG300 is available in a 16-pin SOIC and 16-pin VQFN package. The LOG300 is operational from a 3V to 5.25V supply and over the full ambient temperature range of –40°C to +125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LOG300 40MHz, Logarithmic Detector With Integrated Low-Noise Amplifier datasheet (Rev. A) | 2024年 10月 16日 | |
Application note | Ultrasonic Sensing Using LOG Detector Amplifier | PDF | HTML | 2024年 10月 1日 | |
Certificate | LOG300DEVM EU Declaration of Conformity (DoC) | 2024年 9月 24日 |
設計與開發
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LOG300DEVM — LOG300D 評估模組
LOG300D 評估模組 (EVM) 是一款採用 16 針腳 SOIC 封裝的 LOG300 放大器。此 EVM 可快速且輕鬆展示放大器的功能性和多元用途。EVM 隨時可透過板載連接器來連接電源、訊號源和測試儀器。EVM 經過配置,可在其輸入端輕鬆連接常見的 50Ω 實驗室設備。輸出連接至 SMA 連接器。電路板也包含跨接器,可在不使用時輕鬆停用或啟用 IC 的 LNA 和頻率偵測模組。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點