SN75LVDS051
- Meets or Exceeds the Requirements of ANSI TIA/EIA-644-1995 Standard
- Signaling Rates up to 155 Mbps
- Operates From a Single 3.3-V Supply
- Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 100
Load - LVTTL Input Levels are 5 V Tolerant
- Driver is High Impedance When Disabled or With VCC < 1.5 V
- Receiver has Open-Circuit Fail Safe
- Surface-Mount Packaging
- D Package (SOIC)
- Characterized For Operation From
0°C to 70°C
The SN75LVDS179, SN75LVDS180, SN75LVDS050, and SN75LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 155 Mbps. The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100 load and receipt of 100 mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics).
The SN75LVDS179, SN75LVDS180, SN75LVDS050, and SN75LVDS051 are characterized for operation from 0°C to 70°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | High-Speed Differential Line Drivers And Receivers datasheet (Rev. A) | 2000年 3月 9日 | |
| Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點