現在提供此產品的更新版本
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
TLV2372-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C4B
- Rail-to-Rail Input and Output
- Wide Bandwidth: 3 MHz
- High Slew Rate: 2.4 V/µs
- Supply Voltage Range: 2.7 V to 16 V
- Supply Current: 550 µA/Channel
- Input Noise Voltage: 39 nV/√Hz
- Input Bias Current: 1 pA
- Ultra-Small Packaging:
- 5-Pin SOT-23 (TLV2371-Q1)
The TLV237x-Q1 devices are single-supply operational amplifiers providing rail-to-rail input and output capability. The TLV237x-Q1 takes the minimum operating supply voltage down to 2.7 V and up to 16 V over the extended automotive temperature range. Therefore, the wide voltage range can support both start-stop functionality and a connection directly to the typical 12-V battery. The rail-to-rail capabilities allow the device to maximize the output signal and avoid clipping.
The CMOS inputs enable high-impedance suitable for engine control units (ECU), body control modules (BCM), battery management systems (BMS), and HEV/EV inverters. This also allows the user to draw a lower offset voltage and maintain low power consumption to help meet overall system needs for quiescent current such as in infotainment or cluster, HEV/EV, and powertrain.
Additionally, the TLV237x-Q1 family supports a high common-mode rail to the supply voltage. This feature sets no gain limitations and can support the input at any level without the concern for any phase reversal.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV237x-Q1 550-µA/Channel, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers datasheet (Rev. B) | PDF | HTML | 2016年 12月 23日 |
Functional safety information | TLV2372-Q1 Functional Safety FIT Rate and Failure Mode Distribution | PDF | HTML | 2020年 7月 15日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Technical article | Shining a light on op amps: considerations in LED lighting | PDF | HTML | 2016年 10月 20日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
DUAL-DIYAMP-EVM — 雙通道通用自製 (DIY) 放大器電路評估模組
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點