TLV2475
- CMOS Rail-To-Rail Input/Output
- Input Bias Current: 2.5pA
- Low Supply Current: 600µA/Channel
- Ultra-Low Power Shutdown Mode:
- IDD(SHDN): 350nA/ch at 3V
- IDD(SHDN): 1000nA/ch at 5V
- Gain-Bandwidth Product: 2.8MHz
- High Output Drive Capability:
- ±10mA at 180mV
- ±35mA at 500mV
- Input Offset Voltage: 250µV (typ)
- Supply Voltage Range: 2.7V to 6V
- Ultra-Small Packaging
- SOT23-5 or -6 (TLV2470/1)
- MSOP-8 or -10 (TLV2472/3)
PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) | 2007年 7月 3日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點