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TLV27L2-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range - Device HBM Classification Level 2
- Device CDM Classification Level C6
- Device Temperature Grade 1: –40°C to
- BiMOS Rail-to-Rail Output
- Input Bias Current: 1 pA
- High Wide Bandwidth 160 kHz
- High Slew Rate: 0.1 V/µs
- Supply Current: 7 µA (per channel)
- Input Noise Voltage: 89 nV/√Hz
- Supply Voltage Range: 2.7 V to 16 V
All trademarks are the property of their respective owners.
The TLV27L2-Q1 single-supply operational amplifiers provide rail-to-rail output capability. The TLV27L2-Q1 device takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range, while adding the rail-to-rail output swing feature. The TLV27L2-Q1 device also provides 160-kHz bandwidth from only 7 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) two rechargeable cells.
The rail-to-rail outputs make the TLV27L2-Q1 device good upgrades for the TLC27Lx family of devices which offers more bandwidth at a lower quiescent current. The TLV27L2-Q1 offset voltage is equal to that of the TLC27LxA variant. Their cost effectiveness makes them a good alternative to the TLC225x and TLV225x families of devices, where offset and noise are not of premium importance.
The TLV27L2-Q1 device is available in the commercial temperature range to enable easy migration from the equivalent TLC27Lx.
The TLV27L2-Q1 device is available in an 8-pin SOIC (D) package.
For all available packages, see the orderable addendum at the end of the datasheet.技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV27L2-Q1 Automotive Micropower Rail-to-Rail Output Operational Amplifier datasheet (Rev. A) | PDF | HTML | 2015年 12月 29日 |
E-book | Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. C) | 2018年 11月 30日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
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SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點