TLVM23625

現行

3-V 至 36-V 輸入、1-V 至 6-V 輸出、2.5-A 同步降壓電源模組

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2.5 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 6 EMI features Integrated capacitors, Low parasitic Hotrod packaging
Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2.5 Vin (min) (V) 3 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 6 EMI features Integrated capacitors, Low parasitic Hotrod packaging
QFN-FCMOD (RDN) 11 15.75 mm² 4.5 x 3.5
  • Functional Safety-Capable
  • Versatile synchronous buck DC/DC module:
    • Integrated MOSFETs, inductor, CBOOT capacitor and controller
    • Wide input voltage range of 3V to 36V
    • Input transient protection up to 40 V
    • Junction temperature range –40°C to +125°C
    • Overmolded package of 4.5mm × 3.5mm × 2mm
    • Frequency adjustable from 200kHz to 2.2MHz using the RT pin
  • Ultra-high efficiency across the full load range:
    • Greater than 88% efficiency at 12V VIN,5V VOUT, 1MHz, IOUT = 2.5A
    • Greater than 87% efficiency at 24VIN,5VOUT, 1MHz, IOUT = 2.5A
    • As low as 1.5µA standby IQ at 13.5VIN
  • Optimized for ultra-low EMI requirements:
    • Flip-chip on lead package - FCOL
    • Inductor and boot capacitor integration

    • CISPR 11, Class B compliant-capable
  • Output voltage and current options:
    • Adjustable output voltage from 1V to 6V
  • Designed for scalable power supplies:
    • Pin compatible with:
  • Create a custom design using the TLVM236x5 with the WEBENCH Power Designer
  • Functional Safety-Capable
  • Versatile synchronous buck DC/DC module:
    • Integrated MOSFETs, inductor, CBOOT capacitor and controller
    • Wide input voltage range of 3V to 36V
    • Input transient protection up to 40 V
    • Junction temperature range –40°C to +125°C
    • Overmolded package of 4.5mm × 3.5mm × 2mm
    • Frequency adjustable from 200kHz to 2.2MHz using the RT pin
  • Ultra-high efficiency across the full load range:
    • Greater than 88% efficiency at 12V VIN,5V VOUT, 1MHz, IOUT = 2.5A
    • Greater than 87% efficiency at 24VIN,5VOUT, 1MHz, IOUT = 2.5A
    • As low as 1.5µA standby IQ at 13.5VIN
  • Optimized for ultra-low EMI requirements:
    • Flip-chip on lead package - FCOL
    • Inductor and boot capacitor integration

    • CISPR 11, Class B compliant-capable
  • Output voltage and current options:
    • Adjustable output voltage from 1V to 6V
  • Designed for scalable power supplies:
    • Pin compatible with:
  • Create a custom design using the TLVM236x5 with the WEBENCH Power Designer

The TLVM236x5 is a 1.5A or 2.5A, 36V input synchronous step-down DC/DC power module that combines flip chip on lead (FCOL) packaging, power MOSFETs, integrated inductor and boot capacitor in a compact and easy-to-use 3.5mm × 4.5mm × 2mm, 11-pin QFN package. The small HotRod™ QFN package technology enhances the thermal performance, ensuring high ambient temperature operation. devices can be configured for 1V up to 6V output with a resistor feedback divider.

The TLVM236x5 is specifically designed to meet low standby power requirements for always on, industrial applications. Auto mode enables frequency fold back when operating at light loads, allowing a no load current consumption of 1.5µA at 13.5V VIN and high light load efficiency. A seamless transition between PWM and PFM modes along with low MOSFET on resistances provide exceptional efficiency across the entire load range.

The TLVM236x5 uses peak current mode architecture with internal compensation to maintain stable operation with minimal output capacitance. The RT pin can be used to set the frequency between 200kHz and 2.2MHz to avoid noise sensitive frequency bands.

The TLVM236x5 is a 1.5A or 2.5A, 36V input synchronous step-down DC/DC power module that combines flip chip on lead (FCOL) packaging, power MOSFETs, integrated inductor and boot capacitor in a compact and easy-to-use 3.5mm × 4.5mm × 2mm, 11-pin QFN package. The small HotRod™ QFN package technology enhances the thermal performance, ensuring high ambient temperature operation. devices can be configured for 1V up to 6V output with a resistor feedback divider.

The TLVM236x5 is specifically designed to meet low standby power requirements for always on, industrial applications. Auto mode enables frequency fold back when operating at light loads, allowing a no load current consumption of 1.5µA at 13.5V VIN and high light load efficiency. A seamless transition between PWM and PFM modes along with low MOSFET on resistances provide exceptional efficiency across the entire load range.

The TLVM236x5 uses peak current mode architecture with internal compensation to maintain stable operation with minimal output capacitance. The RT pin can be used to set the frequency between 200kHz and 2.2MHz to avoid noise sensitive frequency bands.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 5
類型 標題 日期
* Data sheet TLVM236x5, 3V to 36V Input, 1V to 6V Output, 1.5A, 2.5A Synchronous Buck Converter Power Module in a HotRod™ QFN Package datasheet (Rev. B) PDF | HTML 2024年 2月 29日
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024年 3月 14日
Functional safety information TLVM23625 Functional Safety FIT Rate, FMD and Pin FMA PDF | HTML 2023年 2月 9日
EVM User's guide TLVM23625EVM User's Guide PDF | HTML 2022年 12月 16日
Certificate TLVM23625EVM EU RoHS Declaration of Conformity (DoC) 2022年 9月 20日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TLVM23625EVM — 適用於 2.5-A 同步降壓電源模組的 TLVM23625 評估模組

TLVM23625 評估模組 (EVM) 可對 TLVM23625 電源模組進行評估。EVM 允許多種電源模組配置。電氣測試點可讓您輕鬆驗證電源穩壓器的性能。TLVM23625EVM 的輸出電壓可設定在 1.8 V 至 6 V 之間,負載電流則可達 2.5 A。此 EVM 可做為選擇最佳 TLVM23625 配置與元件的基礎。
使用指南: PDF | HTML
TI.com 無法提供
封裝 針腳 CAD 符號、佔位空間與 3D 模型
QFN-FCMOD (RDN) 11 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片