TPS650362-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with following results:
- Device operates from 4V to 35V input supply
- Device temperature grade 1: -40°C to +125°C
- Functional Safety -Compliant targeted
- Developed for functional safety applications
- Documentation to aid ISO26262 and IEC61508 system design available upon product release
- Systematic capability and hardware integrity up to ASIL-B and SIL-2 targeted
- Under/overvoltage monitors with Built-In Self-Test
- Watchdog (trigger or Q&A), Error Signal Monitor
- Temperature warning and thermal shutdown
- Wide-VIN step-down converter BUCK1
- VIN range from 4 V to 35 V
- VOUT range from 3 V to 5.5 V
- Output current up to 2000-mA
- 2.2-MHz switching frequency
- Two Low-VIN step-down converters BUCK2, BUCK3:
- VIN range from 3.0 V to 5.5 V
- VOUT range from 0.6 V to 3.4 V
- Output current up to 2700-mA peak
- 2.2-MHz or 4.4-MHz switching frequency
- One low dropout (LDO) regulator:
- VIN range from 3.0 V to 5.5 V
- VOUT range from 1.8 V to 3.4 V
- Up to 300-mA output current
- Low noise and high PSRR
- 3.5-mm × 3.5-mm 24-pin VQFN with wettable flanks
The TPS65036x-Q1 device is a highly integrated power management IC for automotive camera and radar modules and MCU power. This device combines three step-down converters and one low-dropout (LDO) regulator. The BUCK1 step-down converter has an input voltage range up to 35 V. All converters can operate in a forced fixed-frequency PWM mode or an AutoPFM mode and support optional Spread-Spectrum Modulation (SSM) for EMI reduction. The LDO can supply 300 mA and operate with an input voltage range from 3 V to 5.5 V. The TPS65036x-Q1 support Low Power Mode with control from pin or I2C.
The TPS65036x-Q1 is available in a 24-pin VQFN package (3.5 mm × 3.5 mm).
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檢視所有 1 類型 | 標題 | 日期 | ||
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* | Data sheet | TPS65036x-Q1 Automotive Camera, Radar and MCU PMIC datasheet | PDF | HTML | 2024年 5月 23日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN-HR (RAY) | 24 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。