Produktdetails

Local sensor accuracy (max) 1.5 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 2 Features ALERT Supply current (max) (µA) 21 Temp resolution (max) (bps) 12 Remote channels (#) 8 Addresses 4 Rating Space
Local sensor accuracy (max) 1.5 Type Remote Operating temperature range (°C) -55 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, SMBus Supply voltage (max) (V) 2 Features ALERT Supply current (max) (µA) 21 Temp resolution (max) (bps) 12 Remote channels (#) 8 Addresses 4 Rating Space
CFP (HKT) 16 72.136 mm² 10.16 x 7.1
  • QMLV Qualified: 5962R2021401VXC
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
    • Thermally Enhanced 16-Lead Ceramic HKT Package
  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
  • Local Temperature Sensor Accuracy: ±1.5°C
  • Temperature Resolution: 0.0625°C
  • Logic Voltage Range: 1.7 V to 3.6 V
  • Supply Range: 1.7 V to 2.0 V
  • 67 µA Operating Current (1 SPS, All Channels Active)
  • 0.3 µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
  • QMLV Qualified: 5962R2021401VXC
    • Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
    • Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
    • Thermally Enhanced 16-Lead Ceramic HKT Package
  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
  • Local Temperature Sensor Accuracy: ±1.5°C
  • Temperature Resolution: 0.0625°C
  • Logic Voltage Range: 1.7 V to 3.6 V
  • Supply Range: 1.7 V to 2.0 V
  • 67 µA Operating Current (1 SPS, All Channels Active)
  • 0.3 µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet TMP9R00-SP 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor datasheet (Rev. A) PDF | HTML 04 Aug 2022
* Radiation & reliability report TMP9R00-SP Single-Event Effects (SEE) Radiation Test Report PDF | HTML 14 Aug 2023
* SMD TMP9R00-SP SMD 5962-20214 10 Jul 2023
* Radiation & reliability report TMP9R00-SP Total Ionizing Dose (TID) PDF | HTML 15 Aug 2022
Product overview TI Space Qualified Temperature Sensor Product Selection Guide PDF | HTML 13 Dez 2024
Design guide Radiation-Hardened Space Battery Management System (BMS) Reference Design PDF | HTML 12 Dez 2024
Application brief DLA Approved Optimizations for QML Products (Rev. B) PDF | HTML 23 Okt 2024
Selection guide TI Space Products (Rev. J) 12 Feb 2024
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 31 Aug 2023
Application note Remote Temperature Transistor Sensor Selection Guide PDF | HTML 24 Mär 2021
Application note Measuring Die Temperature with Remote Diode Sensing in Space 10 Dez 2018

Design und Entwicklung

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Evaluierungsplatine

TMP9R01EVM — TMP9R01 evaluation module

The TMP9R01EVM is designed to provide a quick setup to evaluate the TMP9R01-SEP device and gain familiarity with the device down to the bit-by-bit register level. In addition to testing the device for common functionality, the evaluation module (EVM) also allows testing under radiation (...)
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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
CFP (HKT) 16 Ultra Librarian

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