Información de empaque
| Encapsulado | Pines DSBGA (YBK) | 4 |
| Rango de temperatura de funcionamiento (℃) -40 to 125 |
| Cant. de paquetes | Empresa de transporte 3,000 | LARGE T&R |
Características para TMP144
- Multiple Device Access (MDA):
- Global read/write operations
- SMAART Wire™ / UART interface
- Resolution: 12-bit or 0.0625°C
- ±1°C maximum (–10°C to +100°C)
- ±2°C maximum (–40°C to +125°C)
- Low quiescent current:
- 3-µA active I Q at 0.25 Hz
- 0.6-µA shutdown
- Supply range: 1.4 V to 3.6 V
- Push-pull digital output
- Package:
- 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
- 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
- 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)
Descripción de TMP144
The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.
The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.
The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.
