DS90CR288A
- 20 to 85 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- 2.5 / 0 ns Set & Hold Times on TxINPUTs
- Low Power Consumption
- ±1V Common-Mode Range (around +1.2V)
- Narrow Bus Reduces Cable Size and Cost
- Up to 2.38 Gbps Throughput
- Up to 297.5 Mbytes/sec Bandwidth
- 345 mV (typ) Swing LVDS Devices for Low EMI
- PLL Requires no External Components
- Rising Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 56-Lead TSSOP Package
The DS90CR287 transmitter converts 28 bits of LVCMOS/LVTTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted.
The DS90CR288A receiver converts the four LVDS data streams back into 28 bits of LVCMOS/LVTTL data. At a transmit clock frequency of 85 MHz, 28 bits of TTL data are transmitted at a rate of 595 Mbps per LVDS data channel. Using a 85 MHz clock, the data throughput is 2.38 Gbit/s (297.5 Mbytes/sec).
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DS90CR287/DS90CR288A 3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link 85MHz datasheet (Rev. G) | 2013/03/05 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018/11/09 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016/01/13 | ||
| EVM User's guide | 28-Bit Channel Link SerDes Evaluation Board 20-85MHz User Guide | 2012/01/25 | ||
| Design guide | Channel Link I Design Guide | 2007/03/29 | ||
| Application note | Multi-Drop Channel-Link Operation | 2004/10/04 | ||
| Application note | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998/10/05 |
설계 및 개발
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치