인터페이스 기타 인터페이스

TLK2711-SP

활성

방사선 내성 1.6~2.5Gbps 클래스-V 트랜시버

제품 상세 정보

Protocols Space Rating Space Operating temperature range (°C) -55 to 125
Protocols Space Rating Space Operating temperature range (°C) -55 to 125
CFP (HFG) 68 195.1609 mm² 13.97 x 13.97
  • 1.6Gbps to 2.5Gbps (Gigabits per second) serializer/deserializer
  • Hot-plug protection
  • High-performance 68-pin ceramic quad flat pack package (HFG)
  • Low-power operation
  • Programmable preemphasis levels on serial output
  • Interfaces to backplane, copper cables, or optical converters
  • On-chip 8-bit/10-bit encoding/decoding, comma detect
  • On-chip PLL provides clock synthesis from low-speed reference
  • Low power: < 500mW
  • 3V tolerance on parallel data input signals
  • 16-bit parallel TTL-compatible data interface
  • Designed for high-speed backplane interconnect and point-to-point data link
  • Military temperature range (–55°C to 125°C Tcase)
  • Loss-of-Signal (LOS) detection
  • Integrated 50Ω termination resistors on RX
  • Engineering evaluation (/EM) samples are available (1)

(1)These units are intended for engineering evaluation only. They are processed to a non-compliant flow (for example, no burn-in, and so forth) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing, or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.

  • 1.6Gbps to 2.5Gbps (Gigabits per second) serializer/deserializer
  • Hot-plug protection
  • High-performance 68-pin ceramic quad flat pack package (HFG)
  • Low-power operation
  • Programmable preemphasis levels on serial output
  • Interfaces to backplane, copper cables, or optical converters
  • On-chip 8-bit/10-bit encoding/decoding, comma detect
  • On-chip PLL provides clock synthesis from low-speed reference
  • Low power: < 500mW
  • 3V tolerance on parallel data input signals
  • 16-bit parallel TTL-compatible data interface
  • Designed for high-speed backplane interconnect and point-to-point data link
  • Military temperature range (–55°C to 125°C Tcase)
  • Loss-of-Signal (LOS) detection
  • Integrated 50Ω termination resistors on RX
  • Engineering evaluation (/EM) samples are available (1)

(1)These units are intended for engineering evaluation only. They are processed to a non-compliant flow (for example, no burn-in, and so forth) and are tested to temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing, or flight use. Parts are not warranted for performance on full MIL specified temperature range of –55°C to 125°C or operating life.

The TLK2711-SP is a member of the WizardLink transceiver family of multigigabit transceivers, intended for use in ultra-high-speed bidirectional point-to-point data transmission systems. The TLK2711-SP supports an effective serial interface speed of 1.6Gbps to 2.5Gbps, providing up to 2Gbps of data bandwidth.

The primary application of the TLK2711-SP is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50Ω. The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

This device can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power and cost savings over parallel solutions, as well as scalability for higher data rates in the future.

The TLK2711-SP performs parallel-to-serial and serial-to-parallel data conversion. The clock extraction functions as a physical layer (PHY) interface device. The serial transceiver interface operates at a maximum speed of 2.5Gbps. The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (TXCLK). The 16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8b/10b) encoding format. The resulting 20-bit word is then transmitted differentially at 20× the reference clock (TXCLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the recovered clock (RXCLK). It then decodes the 20-bit wide data using the 8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data pins (RXD0–RXD15). The outcome is an effective data payload of 1.28Gbps to 2Gbps (16 bits data × the frequency).

The TLK2711-SP is available in a 68-pin ceramic nonconductive tie-bar package (HFG).

The TLK2711-SP provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer, providing the protocol device with a functional self-check of the physical interface.

The TLK2711-SP is a member of the WizardLink transceiver family of multigigabit transceivers, intended for use in ultra-high-speed bidirectional point-to-point data transmission systems. The TLK2711-SP supports an effective serial interface speed of 1.6Gbps to 2.5Gbps, providing up to 2Gbps of data bandwidth.

The primary application of the TLK2711-SP is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50Ω. The transmission media can be printed circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

This device can also be used to replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. It is then reconstructed into its original parallel format. It offers significant power and cost savings over parallel solutions, as well as scalability for higher data rates in the future.

The TLK2711-SP performs parallel-to-serial and serial-to-parallel data conversion. The clock extraction functions as a physical layer (PHY) interface device. The serial transceiver interface operates at a maximum speed of 2.5Gbps. The transmitter latches 16-bit parallel data at a rate based on the supplied reference clock (TXCLK). The 16-bit parallel data is internally encoded into 20 bits using an 8-bit/10-bit (8b/10b) encoding format. The resulting 20-bit word is then transmitted differentially at 20× the reference clock (TXCLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the recovered clock (RXCLK). It then decodes the 20-bit wide data using the 8-bit/10-bit decoding format resulting in 16 bits of parallel data at the receive data pins (RXD0–RXD15). The outcome is an effective data payload of 1.28Gbps to 2Gbps (16 bits data × the frequency).

The TLK2711-SP is available in a 68-pin ceramic nonconductive tie-bar package (HFG).

The TLK2711-SP provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer, providing the protocol device with a functional self-check of the physical interface.

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기술 자료

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15개 모두 보기
유형 직함 날짜
* Data sheet TLK2711-SP 1.6Gbps to 2.5Gbps Class V Transceiver datasheet (Rev. Q) PDF | HTML 2024/08/09
* SMD TLK2711-SP SMD 5962-05221 2016/07/08
* Radiation & reliability report TLK2711 Radiation Test Report 2015/03/31
* Radiation & reliability report TLK2711 TID and SEE Report 2015/03/31
* Radiation & reliability report TLK2711-SP SEE Report 2015/03/31
Application brief DLA Approved Optimizations for QML Products (Rev. B) PDF | HTML 2024/05/17
Selection guide TI Space Products (Rev. J) 2024/02/12
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023/08/31
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 2022/11/17
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 2022/10/19
E-book Radiation Handbook for Electronics (Rev. A) 2019/05/21
White paper TLK2711-SP Unpowered Receiver Stress Evaluation 2018/02/27
Technical article 7 things to know about spacecraft subsystems before your next trip to Mars PDF | HTML 2016/07/06
EVM User's guide TLK2711 Serdes EVM Kit Setup and Usage (Rev. A) 2012/08/10
Application note Using the TLK2711-SP with Minimal Protocol (Rev. A) 2011/08/15

설계 및 개발

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평가 보드

TLK2711EVM-CVAL — TLK2711EVM-CVAL 시리얼라이저/디시리얼라이저 평가 모듈 보드

The Texas Instruments TLK2711 serdes evaluation module (EVM) board is used to evaluate the TLK2711 device for point-to-point data transmission applications. The board enables the designer to connect 50-W parallel buses to both transmitter and receiver connectors. The TLK2711, using high speed PLL (...)

사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

TLK2711-SP IBIS MODEL

SLYM079.ZIP (25 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
CFP (HFG) 68 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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