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TMP006

구형

WCSP 패키지, 적외선 서모파일 비접촉 온도 센서

지금 주문
데이터 시트

TMP006

구형
데이터 시트 지금 주문

제품 상세 정보

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (bps) 14 Rating Catalog
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (bps) 14 Rating Catalog
DSBGA (YZF) 8 3.0625 mm² 1.75 x 1.75
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 
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* Data sheet TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet (Rev. E) PDF | HTML 2015/04/09

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치