홈 센서 온도 센서 디지털 온도 센서
홈
센서
온도 센서
디지털 온도 센서

TMP144

활성

SMAART Wire™/UART 인터페이스를 갖춘 저전력 디지털 온도 센서

지금 주문
데이터 시트

TMP144

활성
데이터 시트 지금 주문

제품 상세 정보

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type UART Supply voltage (max) (V) 3.6 Features Daisy chain Supply current (max) (µA) 3 Temp resolution (max) (bps) 12 Remote channels (#) 0 Addresses 16 Rating Catalog TI functional safety category Functional Safety-Capable
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.4 Interface type UART Supply voltage (max) (V) 3.6 Features Daisy chain Supply current (max) (µA) 3 Temp resolution (max) (bps) 12 Remote channels (#) 0 Addresses 16 Rating Catalog TI functional safety category Functional Safety-Capable
DSBGA (YBK) 4 0.847364 mm² 1.142 x 0.742 DSBGA (YFF) 4 1 mm² 1 x 1 PICOSTAR (YMT) 4 0.5776 mm² 0.76 x 0.76
  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)
  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.
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관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TMP107 활성 데이지 체인 UART, EEPROM 및 알림 기능을 지원하는 ±0.4°C 온도 센서 Similar UART interface, higher accuracy (0.4°C) in bigger SOIC-8 package
신규 TMP110 활성 소형 X2SON 패키지의 알림을 지원하는 ±1.0°C 정확도 I²C 온도 센서 I2C device with similar accuracy (1°C), in similar size (0.8 × 0.8 mm) in a plastic-encapsulated X2SON package
TMP114 활성 0.2°C의 정확도를 가진 0.15mm 높이, 1.2V 지원 온도 센서 I2C device with similar/better accuracy (1°C / 0.2°C), in similar size (0.76 × 0.76 mm) and height (150 μm)
신규 TMP118 활성 ±0.1°C 정확도, 초음파(336μm²) 얇은( 240μm) I²C 디지털 온도 센서 I2C device with improved accuracy (±0.1°C), smaller (336 μm²), slightly thicker (240 μm)

기술 자료

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5개 모두 보기
유형 직함 날짜
* Data sheet TMP144 Low-Power, Digital Temperature Sensor With SMAART Wire™ / UART Interface datasheet (Rev. C) PDF | HTML 2023/03/15
Application note How to Read and Interpret Digital Temperature Sensor Output Data (Rev. A) PDF | HTML 2025/01/21
Application note Under-Component Monitoring With Ultra-Small Temperature Sensors (Rev. A) PDF | HTML 2023/04/21
Application brief Efficient Cold Chain Management With Scalable High-Accuracy Temperature Sensors (Rev. A) PDF | HTML 2020/12/11
Application note How to Boost Your CPU, GPU, and SoC Performance Through Thermal Accuracy PDF | HTML 2020/09/22

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TMP144EVM — SMAART Wire™ 인터페이스를 갖춘 TMP144 저전력, 디지털 온도 센서 평가 모듈

The TMP144 digital output temperature sensor is capable of reporting temperature with 0.0625°C resolution. The SMAART Wire™ Interface supports up to 16 devices connected serially in conjunction with a UART host. The TMP144EVM leverages the MSP430F5528 to create a USB-to-SMAART Wire(TM) (...)
사용 설명서: PDF
View Options
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YBK) 4 Ultra Librarian
DSBGA (YFF) 4 Ultra Librarian
PICOSTAR (YMT) 4 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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포럼 주제 모두 보기(영문)

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