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TPIC1021
- LIN physical layer specification revision 2.1 compliant conforms to SAEJ2602 recommended practice for LIN
- LIN bus speed up to 20 kbps
- ESD protection to 12 kV (human body model) on LIN pin
- LIN pin handles voltage from –40 V to 40 V
- Survives transient damage in automotive environment (ISO 7637)
- Operation with supply from 7-V to 27-V DC
- Two operation modes: normal and low-power (sleep) mode
- Low current consumption in low power mode
- Wake-up available from LIN bus, wake-up input (external switch) or host MCU
- Interfaces to MCU with 5-V or 3.3-V I/O pins
- Dominant state timeout protection on TXD pin
- Wake-up request on RXD pin
- Control of external voltage regulator (INH Pin)
- Integrated pull-up resistor and series diode for LIN responder applications
- Low EME (electromagnetic emissions), high EMI (electromagnetic immunity)
- Bus terminal short-circuit protected for short to battery or short to ground
- Thermally protected
- Ground disconnection fail-safe at system level
- Ground shift operation at system level
- Unpowered node does not disturb the network
The TPIC1021 is the LIN (Local Interconnect Network) physical interface, which integrates the serial transceiver with wake up and protection features. The LIN bus is a single wire, bi-directional bus typically used for low-speed in-vehicle networks using baud rates between 2.4 kbps and 20 kbps.
The LIN bus has two logical values: the dominant state (voltage near ground) represents a logic 0 and the recessive state (voltage near battery) and represents logic 1.
In the recessive state, the LIN bus is pulled high by the TPIC1021 internal pull-up resistor (30 kΩ) and series diode, so no external pullup components are required for responder applications. Commander applications require an external pullup resistor (1 kΩ) plus a series diode.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPIC1021 LIN Physical Interface datasheet (Rev. E) | PDF | HTML | 2022/05/31 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치