TPS51100
- Input Voltage Range: 4.75 V to 5.25 V
- VLDOIN Voltage Range: 1.2 V to 3.6 V
- 3-A Sink/Source Termination Regulator
Includes Droop Compensation - Requires Only 20-μF Ceramic Output
Capacitance - Supports Hi-Z in S3 and Soft-Off in S5
- 1.2-V Input (VLDOIN) Helps Reduce Total
Power Dissipation - Integrated Divider Tracks 0.5 VDDQSNS for
VTT and VTTREF - Remote Sensing (VTTSNS)
- ±20-mV Accuracy for VTT and VTTREF
- 10-mA Buffered Reference (VTTREF)
- Built-In Soft-Start, UVLO, and OCL
- Thermal Shutdown
- Supports JEDEC Specifications
The TPS51100 is a 3-A, sink/source tracking termination regulator. The device is specifically designed for low-cost and low-external component count systems where space is a premium.
The TPS51100 maintains fast transient response, only requiring 20 µF (2 × 10 µF) of ceramic output capacitance. The TPS51100 supports remote sensing functions and all features required to power the DDR and DDR2 VTT bus termination according to the JEDEC specification. The part also supports DDR3 VTT termination with VDDQ at 1.5 V (typical). In addition, the TPS51100 includes integrated sleep-state controls, placing VTT in Hi-Z in S3 (suspend to RAM) and soft-off for VTT and VTTREF in S5 (suspend to disk). The TPS51100 is available in the thermally efficient 10-pin MSOP PowerPAD™ package and is specified from 40°C to 85°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPS51100 3-A Sink / Source DDR Termination Regulator datasheet (Rev. E) | PDF | HTML | 2014/12/17 |
Application note | LDO Noise Demystified (Rev. B) | PDF | HTML | 2020/08/18 | |
Application note | DDR VTT Power Solutions: A Competitive Analysis (Rev. A) | 2020/07/09 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018/06/25 | ||
Application note | LDO PSRR Measurement Simplified (Rev. A) | PDF | HTML | 2017/08/09 | |
User guide | Using the TPS51100 | 2004/07/13 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HVSSOP (DGQ) | 10 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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