TPS62421
- High Efficiency up to 95%
- VIN Range from 2.5 V to 6 V
- 2.25-MHz Fixed Frequency Operation
- Output Current 600 mA and 1000 mA
- Adjustable Output Voltage from 0.6 V to VIN
- Pin Selectable Output Voltage Supports Simple
Dynamic VoltageScaling - Optional EasyScale One-Pin Serial Interface for
Dynamic Output Voltage Adjustment - Power-Save Mode at Light Load Currents
- 180° Out of Phase Operation
- Output Voltage Accuracy in PWM Mode ±1%
- Typical 32-µA Quiescent Current for both
Converters - 100% Duty Cycle for Lowest Dropout
- Available in a 10-Pin VSON (3 mm × 3 mm)
The TPS6242x device is a synchronous dual step-down DCDC converter. It provides two independent output voltage rails powered by 1-cell Li-Ion or 3-cell NiMH/NiCD batteries. The device is also suitable to operate from a standard 3.3-V or 5-V voltage rail.
With an input voltage range of 2.5 V to 6 V, the TPS6242x is ideal for battery-powered portable applications like smart phones, PDAs, and other portable equipment.
With the EasyScale™ serial interface the output voltages can be modified during operation. It therefore supports dynamic voltage scaling for low power DSP and processors.
The TPS6242x operates at 2.25-MHz fixed switching frequency and enter the power-save mode operation at light load currents to maintain high efficiency over the entire load current range. For low-noise applications the devices can be forced into fixed-frequency PWM mode by pulling the MODE/DATA pin High. In the shutdown mode, the current consumption is reduced to 1.2 µA. The device allows the use of small inductors and capacitors to achieve a small solution size.
The TPS6242x operates over a free-air temperature range of 40°C to 85°C. It is available in a 10-pin leadless package (3 mm × 3 mm VSON)
기술 자료
설계 및 개발
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TPS62421 PSpice Unencrypted Transient Model Package (Rev. A)
5Vin Power Design Using an Integrated FET DC/DC Converter with Dual Outputs (Rev. B)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VSON (DRC) | 10 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치