전원 관리 멀티 채널 IC(PMIC)

TPS65835

활성

액티브 셔터 3D 안경용 MSP430이 통합된 고급 전원 관리 IC(PMIC)

제품 상세 정보

Regulated outputs (#) 2 Step-down DC/DC converter 0 Step-up DC/DC converter 0 LDO 1 Vin (min) (V) 2.5 Vin (max) (V) 6.5 Vout (min) (V) 2.2 Vout (max) (V) 16 Iout (max) (A) 0.15 Configurability Software configurable Features Comm control, Power good Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 1 Iq (typ) (mA) 0.039 Shutdown current (ISD) (typ) (µA) 0.5
Regulated outputs (#) 2 Step-down DC/DC converter 0 Step-up DC/DC converter 0 LDO 1 Vin (min) (V) 2.5 Vin (max) (V) 6.5 Vout (min) (V) 2.2 Vout (max) (V) 16 Iout (max) (A) 0.15 Configurability Software configurable Features Comm control, Power good Rating Catalog Operating temperature range (°C) -40 to 85 Step-down DC/DC controller 0 Step-up DC/DC controller 1 Iq (typ) (mA) 0.039 Shutdown current (ISD) (typ) (µA) 0.5
VQFN (RKP) 40 25 mm² 5 x 5
  • Power Management Core
    • Linear Charger
      • Three Charger Phases: Pre-Charge, Fast
        Charge, and Charge Termination
      • LED Current Sinks for Power Good and
        Charger Status Indication
    • Low-Dropout Regulator (LDO) Supply for
      External Modules & Integrated MSP430 Power
    • Boost Converter
      • Adjustable Output Voltage: 8 V to 16 V
    • Full H-Bridge Analog Switches
      • Internally Controlled by MSP430 Core for
        System Functions
  • MSP430 Core
    • Ultralow Power Consumption
      • Active Mode: 280 µA at 1 MHz, 2.2 V
      • Standby Mode: 0.5 µA
      • Off Mode (RAM Retention): 0.1 µA
    • Five Power-Saving Modes
    • 16-Bit RISC Architecture
    • 16-kB Flash
    • with Three
      Capture/Compare Registers
    • 10-Bit 200-ksps A/D Converter with Internal
      Reference, Sample-and-Hold, and Autoscan
    • Universal Serial Communications Interface,
      Supports IrDA Encode/Decode and
      Synchronous SPI
      • Enhanced UART Supporting Auto Baudrate
        Detection (LIN)
      • IrDA Encoder and Decoder
      • Synchronous SPI
      • I2C
    • Serial Onboard Programming
      • No External Programming Voltage Needed
      • Programmable Code Protection by Security
        Fuse
    • For Complete Module Descriptions, See the
      MSP430x2xx Family User’s Guide (SLAU144)
  • Power Management Core
    • Linear Charger
      • Three Charger Phases: Pre-Charge, Fast
        Charge, and Charge Termination
      • LED Current Sinks for Power Good and
        Charger Status Indication
    • Low-Dropout Regulator (LDO) Supply for
      External Modules & Integrated MSP430 Power
    • Boost Converter
      • Adjustable Output Voltage: 8 V to 16 V
    • Full H-Bridge Analog Switches
      • Internally Controlled by MSP430 Core for
        System Functions
  • MSP430 Core
    • Ultralow Power Consumption
      • Active Mode: 280 µA at 1 MHz, 2.2 V
      • Standby Mode: 0.5 µA
      • Off Mode (RAM Retention): 0.1 µA
    • Five Power-Saving Modes
    • 16-Bit RISC Architecture
    • 16-kB Flash
    • with Three
      Capture/Compare Registers
    • 10-Bit 200-ksps A/D Converter with Internal
      Reference, Sample-and-Hold, and Autoscan
    • Universal Serial Communications Interface,
      Supports IrDA Encode/Decode and
      Synchronous SPI
      • Enhanced UART Supporting Auto Baudrate
        Detection (LIN)
      • IrDA Encoder and Decoder
      • Synchronous SPI
      • I2C
    • Serial Onboard Programming
      • No External Programming Voltage Needed
      • Programmable Code Protection by Security
        Fuse
    • For Complete Module Descriptions, See the
      MSP430x2xx Family User’s Guide (SLAU144)

The TPS65835 is a power management unit (PMU) for active shutter 3D glasses consisting of a power management core and an MSP430 microcontroller. The power management core has an integrated power path, linear charger, LDO, boost converter, and full H-bridge analog switches for left and right shutter operation in a pair of active shutter 3D glasses. The MSP430 core supports the synchronization and communications from an IR, RF, or other communications module through the integrated universal serial communications and timer interfaces for operation of the H-bridge switches on the power management core.

The TPS65835 is a power management unit (PMU) for active shutter 3D glasses consisting of a power management core and an MSP430 microcontroller. The power management core has an integrated power path, linear charger, LDO, boost converter, and full H-bridge analog switches for left and right shutter operation in a pair of active shutter 3D glasses. The MSP430 core supports the synchronization and communications from an IR, RF, or other communications module through the integrated universal serial communications and timer interfaces for operation of the H-bridge switches on the power management core.

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비교 대상 장치와 유사한 기능
TPS65735 활성 액티브 셔터 3D 안경을 위한 전원 관리 IC(PMIC) This product has an external MCU.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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4개 모두 보기
유형 직함 날짜
* Data sheet TPS65835 Advanced PMU With Integrated MSP430 for Active Shutter 3D Glasses datasheet (Rev. A) PDF | HTML 2016/01/06
Selection guide Power Management Guide 2018 (Rev. R) 2018/06/25
Application note Understanding the Absolute Maximum Ratings of the SW Node (Rev. A) 2012/01/13
EVM User's guide TPS65835EVM-705 (Rev. A) 2011/07/15

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPS65835EVM-705 — TPS65835 단일 칩 전원 관리 디바이스용 평가 모듈

The TPS65835EVM-705 is a fully assembled and tested platform for evaluating the performance of the TPS65835 single-chip power management device. The user's guide document includes schematic diagrams, a printed circuit board (PCB) layout, bill of materials, and test data. Throughout this document, (...)

사용 설명서: PDF
TI.com에서 구매 불가
지원 소프트웨어

SLVC494 TPS6583x PMU3D Source File

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
멀티 채널 IC(PMIC)
TPS65835 액티브 셔터 3D 안경용 MSP430이 통합된 고급 전원 관리 IC(PMIC)
패키지 CAD 기호, 풋프린트 및 3D 모델
VQFN (RKP) 40 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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