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TPS735-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Input voltage: 2.7 V to 6.5 V
- 500-mA low-dropout regulator with EN
- Low IQ: 46 µA
- Multiple output voltage versions available:
- Fixed outputs of 1 V to 4.3 V
- Adjustable outputs from 1.25 V to 6 V
- High PSRR: 68 dB at 1 kHz
- Low noise: 13.2 µVRMS
- Fast startup time: 45 µs
- Stable with a low-ESR, 2-µF output capacitor
- Excellent load and line transient response
- 2% overall accuracy
(load, line, temperature, VOUT > 2.2 V) - Low dropout: 280 mV at 500 mA
- 3-mm × 3-mm VSON-8 packages
The TPS735-Q1 family of low-dropout (LDO), low-power linear regulators offers excellent ac performance with very low ground current. High power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient responses are provided while consuming a very low 46 µA (typical) ground current.
The TPS735-Q1 family of devices is stable with ceramic capacitors and uses an advanced BiCMOS fabrication process to yield a typical dropout voltage of 280 mV at 500-mA output. The TPS735-Q1 family of devices uses a precision voltage reference and feedback loop to achieve overall accuracy of 2% (VOUT > 2.2 V) over all load, line, process, and temperature variations. This family of devices is fully specified from TA = –40°C to 125°C and is offered in a low-profile, 3-mm × 3-mm VSON package.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPS735-Q1 500-mA, low quiescent current, low-noise, high PSRR, low-dropout linear regulator datasheet (Rev. B) | PDF | HTML | 2019/02/04 |
| Functional safety information | TPS735-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2024/07/31 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
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주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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