TS3USBA225
- 2.7-V to 5.0-V Operating Power Supply (VCC)
- MHL/High-Speed USB (480 Mbps) Switch:
- V I/O Accepts Signals up to 4.5 V (Independent of VCC)
- 6.5 Ω rON Typical
- 3 pF CON Typical
- 1.9 GHz Bandwidth (–3 dB)
- Audio Switch:
- 2.5 Ω rON Typical
- Negative Rail Capability down to –1.8 V
- Low THD: < 0.05%
- Internal Shunt Resistors for Click-and-Pop Reduction
- 1.8-V Compatible Control Input (SEL1 and SEL2) Threshold
- Minimized Current Consumption (~5 µA) in Power-Down Mode
- Power-Off Protection: All I/O Pins are High-Z when VCC= 0 V
- 12-Pin QFN Package (2 mm × 1.7 mm, 0.4 mm Pitch)
- ESD Performance Tested per JESD 22
- 2000 V Human-Body Model
(A114-B, Class II) - 1000 V Charged-Device Model (C101)
- 2000 V Human-Body Model
The TS3USBA225 is a 2-channel single-pole triple-throw (SP3T) multiplexer that supports USB 2.0 High-Speed (480 Mbps) signals in all 3 differential channels. The first two high-speed differential channels also support Mobile High Definition Link (MHL) signaling with resolution and video frame rates up to 720p, 60 fps and 1080i, 30 fps. The remaining differential channel can also be used as an audio switch that is designed to allow analog audio signals to swing negatively. This configuration allows the system designer to use a common connector for audio and USB 2.0 or MHL data.
The TS3USBA225 has a VCC range of 2.7 V to 5.0 V with the capability to pass true-ground audio signals down to –1.8 V. The device also supports a power-down mode that can be enabled when both SEL1 and SEL2 controls are low to minimize current consumption when no signal is transmitting. The TS3USBA225 also features internal shunt resistors on the audio path to reduce clicks and pops that may be heard when the audio switches are selected.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TS3USBA225 USB 2.0 High-Speed (480 Mbps) and Audio Switches with Negative Signal Capability and 1.8-V Logic Compatibility and Power-Down Mode datasheet (Rev. C) | PDF | HTML | 2015/08/27 |
Application note | High-Speed Interface Layout Guidelines (Rev. J) | PDF | HTML | 2023/02/24 |
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주문 및 품질
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- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
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