CLC007
- No External Pull-Down Resistors
- Differential Input and Output
- Low Power Dissipation
- Single +5V or −5.2V Supply
- Replaces GS9007 in Most Applications
Key Specifications
- 650 ps Rise and Fall Times
- Data Rates to 400 Mbps
- 2 Sets of Complimentary Outputs
- 200 mV Differential Input
- Low Residual Jitter (25 pspp)
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The Texas Instruments Comlinear CLC007 is a monolithic, high-speed cable driver designed for the SMPTE 259M serial digital video data transmission standard. The CLC007 drives 75Ω transmission lines (Belden 8281 or equivalent) at data rates up to 400 Mbps. Controlled output rise and fall times (750 ps typical) minimize transition-induced jitter. The output voltage swing, typically 1.65V, set by an accurate, low-drift internal bandgap reference, delivers an 800 mV swing to back-matched and terminated 75Ω cable.
The CLC007’s class AB output stage consumes less power than other designs, 195 mW with all outputs terminated, and requires no external bias resistors. The differential inputs accept a wide range of digital signals from 200 mVP-P to ECL levels within the specified common-mode limits. All this make the CLC007 an excellent general purpose high speed driver for digital applications.
The CLC007 is powered from a single +5V or −5.2V supply and comes in an 8-pin SOIC package.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | CLC007 Serial Digital Cable Driver with Dual Complementary Outputs datasheet (Rev. E) | 2013年 4月 12日 | |
| Application note | AN-1943 Understanding Serial Digital Video Bit Rates (Rev. A) | 2013年 4月 26日 | ||
| Application note | AN-2145 Power Considerations for SDI Products (Rev. B) | 2013年 4月 26日 | ||
| Application note | AN-2146 Power Design for SDI and Other Noise-Sensitive Devices (Rev. A) | 2013年 4月 26日 | ||
| Application note | High-Speed Board Layout Challenges in FPGA/SDI Sub-Systems | 2009年 11月 12日 | ||
| Application note | Use Video Standards for Eye-Opening Data Transmission: Mega-bits @ Many Meters | 1999年 12月 29日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點