DS90CR217
- 20 to 85 MHz Shift Clock Support
- 50% Duty Cycle on Receiver Output Clock
- Best-in-Class Set & Hold Times on TxINPUTs
- Low Power Consumption
- ±1V Common-Mode Range (Around +1.2V)
- Narrow Bus Reduces Cable Size and Cost
- Up to 1.785 Gbps Throughput
- Up to 223 Mbytes/sec Bandwidth
- 345 mV (typ) Swing LVDS Devices for Low EMI
- PLL Requires No External Components
- Rising Edge Data Strobe
- Compatible with TIA/EIA-644 LVDS Standard
- Low Profile 48-Lead TSSOP Package
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The DS90CR217 transmitter converts 21 bits of CMOS/TTL data into three LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fourth LVDS link. Every cycle of the transmit clock 21 bits of input data are sampled and transmitted. At a transmit clock frequency of 85 MHz, 21 bits of TTL data are transmitted at a rate of 595 Mbps per LVDS data channel. Using a 85 MHz clock, the data throughput is 1.785 Gbit/s (223 Mbytes/sec).
The narrow bus and LVDS signalling of the DS90CR217 is an ideal means to solve EMI and cable size problems associated with wide, high-speed TTL interfaces.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90CR217 +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link - 85 MHz datasheet (Rev. A) | 2013年 2月 19日 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||
| Application note | Improving the Robustness of Channel Link Designs with Channel Link II Ser/Des (Rev. A) | 2013年 4月 26日 | ||
| Design guide | Channel Link I Design Guide | 2007年 3月 29日 | ||
| Application note | Multi-Drop Channel-Link Operation | 2004年 10月 4日 | ||
| Application note | CHANNEL LINK Moving and Shaping Information In Point-To-Point Applications | 1998年 10月 5日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 48 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點