DS90LV018A
- >400 Mbps (200 MHz) Switching Rates
- 50 ps Differential Skew (Typical)
- 2.5 ns Maximum Propagation Delay
- 3.3V Power Supply Design
- Flow-Through Pinout
- Power Down High Impedance on LVDS Inputs
- Low Power Design (18mW @ 3.3V Static)
- Interoperable with Existing 5V LVDS Networks
- Accepts Small Swing (350 mV Typical) Differential Signal Levels
- Supports Open, Short and Terminated Input Fail-Safe
- Conforms to ANSI/TIA/EIA-644 Standard
- Industrial Temperature Operating Range
- (−40°C to +85°C)
- Available in SOIC Package
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The DS90LV018A is a single CMOS differential line receiver designed for applications requiring ultra low power dissipation, low noise and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The DS90LV018A accepts low voltage (350 mV typical) differential input signals and translates them to 3V CMOS output levels. The receiver also supports open, shorted and terminated (100Ω) input fail-safe. The receiver output will be HIGH for all fail-safe conditions. The DS90LV018A has a flow-through design for easy PCB layout.
The DS90LV018A and companion LVDS line driver provide a new alternative to high power PECL/ECL devices for high speed point-to-point interface applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV018A 3V LVDS Single CMOS Differential Line Receiver datasheet (Rev. D) | 2013年 4月 16日 | |
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | DACx1416 Delivers Optimized Solution to Mach Zehnder Modulator Biasing | 2018年 6月 29日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。