DS90LV019
- LVDS Signaling
- 3.3V or 5.0V operation
- Low power CMOS design
- Balanced Output Impedance
- Glitch free power up/down (Driver disabled)
- High Signaling Rate Capacity (above 100 Mbps)
- Ultra Low Power Dissipation
- ±1V Common-Mode Range
- ±100 mV Receiver Sensitivity
- Product offered in SOIC and TSSOP packages
- Flow-Through Pin Out
- Industrial Temperature Range Operation
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
The DS90LV019 is a Driver/Receiver designed specifically for the high speed low power point-to-point interconnect applications. The device operates from a single 3.3V or 5.0V power supply and includes one differential line driver and one receiver. The DS90LV019 features an independent driver and receiver with TTL/CMOS compatibility (DIN and ROUT). The logic interface provides maximum flexibility as 4 separate lines are provided (DIN, DE, RE#, and ROUT). The device also features a flow-through pin out which allows easy PCB routing for short stubs between its pins and the connector. The driver has 3.5 mA output loop current.
The driver translates between TTL levels (single-ended) to Low Voltage Differential Signaling levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common-mode noise rejection.
The receiver threshold is ±100 mV over a ±1V common-mode range and translates the low swing differential levels to standard (TTL/CMOS) levels.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV019 3.3V or 5V LVDS Driver/Receiver datasheet (Rev. B) | 2004年 5月 14日 | |
More literature | Die D/S DS90LV019 MDC 3.3V Or 5V Lvds Driver/Receiver | 2012年 9月 7日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
TSSOP (PW) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。