DS90LV027
- Ultra Low Power Dissipation
- Operating Range above 155 Mbps
- Flow-through pinout simplifies PCB layout
- Conforms to TIA/EIA-644 Standard
- 8-Lead SOIC Package Saves Space
- VCM ±1V center around 1.2V
- Low Differential Output Swing Typical 340 mV
- Power Off Protection (outputs in high impedance)
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The DS90LV027 is a dual LVDS driver device optimized for high data rate and low power applications. The DS90LV027 is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is in a 8-lead SOIC package. The DS90LV027 has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its low output swings typically 340 mV. Perfect for high speed transfer of clock and data. Pair with any of TI's LVDS receivers.
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檢視所有 4 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90LV027 LVDS Dual High Speed Differential Driver datasheet (Rev. C) | 2013年 4月 16日 | |
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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開發板
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使用指南: PDF
模擬工具
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
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模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
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使用指南: PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。