DS90LV027A
- >600-Mbps (300 MHz) Switching Rates
- 0.3-ns Typical Differential Skew
- 0.7-ns Maximum Differential Skew
- 1.5-ns Maximum Propagation Delay
- 3.3-V Power Supply Design
- ±360-mV Differential Signaling
- Low Power Dissipation (46 mW at 3.3-V Static)
- Flow-Through Design Simplifies PCB Layout
- Interoperable With Existing 5-V LVDS Devices
- Power-Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Pin SOIC Package Saves Space
- Industrial Temperature Operating Range:
–40°C to 85°C
The DS90LV027A is a dual LVDS driver device optimized for high data rate and low-power applications. The device is designed to support data rates in excess of 600 Mbps (300 MHz) using Low Voltage Differential Signaling (LVDS) technology. The DS90LV027A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.
The device is in a 8-pin SOIC package. The DS90LV027A has a flow-through design for easy printed-circuit board (PCB) layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high-speed transfer of clock and data. The DS90LV027A can be paired with its companion dual line receiver, the DS90LV028A, or with any of TIs LVDS receivers, to provide a high-speed point-to-point LVDS interface.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV027A LVDS Dual High Speed Differential Driver datasheet (Rev. D) | PDF | HTML | 2016年 6月 23日 |
Application note | Applications of Low-Voltage Differential Signaling (LVDS) in LED Walls | 2020年 10月 29日 | ||
Certificate | DS90LV027A-28AEVM EU Declaration of Conformity (DoC) | 2020年 7月 10日 | ||
Application note | Applications of Low-Voltage Differential Signaling (LVDS) in Ultrasound Scanners | 2019年 6月 29日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
DS90LV027A-28AEVM — 二通道 LVDS 驅動器和接收器評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。