DS90LV031A
- >400-Mbps (200-MHz) Switching Rates
- 0.1-ns Typical Differential Skew
- 0.4-ns Maximum Differential Skew
- 2-ns Maximum Propagation Delay
- 3.3-V Power Supply Design
- ±350-mV Differential Signaling
- Low Power Dissipation (13-mW at 3.3-V Static)
- Interoperable With Existing 5-V LVDS Devices
- Compatible With IEEE 1596.3 SCI LVDS Standard
- Compatible With TIA/EIA-644 LVDS Standard
- Industrial Operating Temperature Range
- Available in SOIC and TSSOP Surface-Mount Packaging
The DS90LV031A is a quad CMOS differential line driver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology.
The DS90LV031A accepts low voltage LVTTL or LVCMOS input levels and translates them to low voltage (350 mV) differential output signals. In addition the driver supports a TRI-STATE® function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 13 mW typical.
The EN and EN* inputs allow active Low or active High control of the TRI-STATE outputs. The enables are common to all four drivers. The DS90LV031A and companion line receiver (DS90LV032A) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV031A 3-V LVDS Quad CMOS Differential Line Driver datasheet (Rev. D) | PDF | HTML | 2016年 8月 25日 |
Application note | AN-1110 LVDS Quad Dynamic I CC vs Frequency | 2004年 5月 15日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。