DS90LV031AQML
- High impedance LVDS outputs with power-off
- Low differential skew
- Low propagation delay
- 3.3V power supply design
- ±350 mV differential signaling
- Low power dissipation
- Interoperable with existing 5V LVDS devices
- Compatible with IEEE 1596.3 SCI LVDS standard
- Compatible with proposed TIA/EIA-644 LVDS standard
- Pin compatible with DS26C31
- Typical Rise/Fall times of 800pS.
- Typical Tri-State Enable/Disable delays of less than 5nS.
All trademarks are the property of their respective owners. TRI-STATE is a trademark of Texas Instruments.
The DS90LV031A is a quad CMOS differential line driver designed for applications requiring ultra low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The DS90LV031A accepts low voltage TTL/CMOS input levels and translates them to low voltage (350 mV) differential output signals. In addition the driver supports a TRI-STATE function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 13 mW typical.
The EN and EN* inputs allow active Low or active High control of the TRI-STATE outputs. The enables are common to all four drivers. The DS90LV031A and companion line receiver (DS90LV032A) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV031AQML 3V LVDS Quad CMOS Differential Line Driver datasheet (Rev. A) | 2013年 4月 17日 | |
* | SMD | DS90LV031AQML SMD 5962-98651 | 2016年 6月 21日 | |
More literature | Die D/S DS90LV031 MDS 3V LVDS Quad CMOS Differential Line Driver | 2012年 9月 7日 |
設計與開發
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DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CFP (NAD) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。