DS90LV032A
- >400 Mbps (200 MHz) Switching Rates
- 0.1-ns Channel-to-Channel Skew (Typical)
- 0.1-ns Differential Skew (Typical)
- 3.3-ns Maximum Propagation Delay
- 3.3-V Power Supply Design
- Power Down High Impedance on LVDS Inputs
- Low Power Design (40 mW at 3.3 V Static)
- Interoperable With Existing 5-V LVDS Networks
- Accepts Small Swing (350 mV Typical) VID
- Supports Open, Short, and Terminated Input Fail-Safe
- Compatible With ANSI/TIA/EIA-644
- Industrial Temperature Operating Range (–40°C to 85°C)
- Available in SOIC and TSSOP Packaging
The DS90LV032A is a quad CMOS differential line receiver designed for applications requiring ultra-low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology.
The DS90LV032A accepts low voltage (350 mV typical) differential input signals and translates them to 3-V CMOS output levels. The receiver supports a TRI-STATE function that may be used to multiplex outputs. The receiver also supports open, shorted, and terminated (100 Ω) input Fail-safe. The receiver output is HIGH for all fail-safe conditions.
The DS90LV032A and companion LVDS line driver (for example, DS90LV031A) provide a new alternative to high power PECL or ECL devices for high speed point-to-point interface applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV032A 3-V LVDS Quad CMOS Differential Line Receiver datasheet (Rev. D) | PDF | HTML | 2016年 8月 24日 |
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
More literature | Die D/S DS90LV032A MDS (PRELIMINARY) 3V LVDS Quad CMOS Diff Line Receive | 2012年 12月 20日 | ||
Application note | AN-1110 LVDS Quad Dynamic I CC vs Frequency | 2004年 5月 15日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。