DS90LV049H
- High Temperature +125°C Operating Range
- Up to 400-Mbps Switching Rates
- Flow-Through Pinout Simplifies PCB Layout
- 50-ps Typical Driver Channel-to-Channel Skew
- 50-ps Typical Receiver Channel-to-Channel Skew
- 3.3-V Single Power Supply Design
- TRI-STATE Output Control
- Internal Fail-Safe Biasing of Receiver Inputs
- Low Power Dissipation (70 mW at 3.3-V Static)
- High Impedance on LVDS Outputs on Power Down
- Conforms to TIA/EIA-644-A LVDS Standard
- Available in Low Profile 16-Pin TSSOP Package
The DS90LV049H is a dual CMOS differential line driver-receiver pair designed for applications requiring ultra low power dissipation, exceptional noise immunity, and high data throughput. The device is designed to support data rates in excess of 400 Mbps utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV049H TSSOP package allows for flow-through routing for easy PCB layout.
The DS90LV049H drivers accept LVTTL/LVCMOS signals and translate them to LVDS signals. The receivers accept LVDS signals and translate them to 3-V CMOS signals. The LVDS input buffers have internal fail-safe biasing that places the outputs to a known H (high) state for floating receiver inputs. In addition, the DS90LV049H supports a TRI-STATE function for a low idle power state when the device is not in use.
The EN and EN inputs are ANDed together and control the TRI-STATE outputs. The enables are common to all four gates.
您可能會感興趣的類似產品
引腳對引腳且具備與所比較裝置相同的功能
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS90LV049H high temperature 3-V LVDS dual line driver and receiver pair datasheet (Rev. B) | PDF | HTML | 2019年 1月 21日 |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
DS90LV047-48AEVM — DS90LV047-48AEVM 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。