DS91M124
- DC - 125 MHz / 250 Mbps Low Jitter, Low Skew, Low Power Operation
- Independent Driver Enable Pins
- Conforms to TIA/EIA-899 M-LVDS Standard
- Controlled Transition Times Minimize Reflections
- 8 kV ESD on M-LVDS I/O Pins Protects Adjoining Components
- Flow-Through Pinout Simplifies PCB Layout
- Industrial Operating Temperature Range (−40°C to +85°C)
- Available in a Space Saving SOIC-16 Package
All trademarks are the property of their respective owners.
The DS91M124 is a 1:4 M-LVDS repeater for driving and distributing clock or data signals to up to four multipoint networks.
M-LVDS (Multipoint LVDS) is a new family of bus interface devices based on LVDS technology specifically designed for multipoint and multidrop cable and backplane applications. It differs from standard LVDS in providing increased drive current to handle double terminations that are required in multi-point applications. Controlled transition times minimize reflections that are common in multipoint configurations due to unterminated stubs.
A single DS91M124 channel is a 1:4 repeater that accepts LVTTL/LVCMOS signals at the driver inputs and converts them to differential M-LVDS signal levels. It features independent driver enable pins for each driver output.
The DS91M124 has a flow-through pinout for easy PCB layout. It provides a new alternative for high speed multipoint interface applications. It is packaged in a space saving SOIC-16 package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS91M124 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input datasheet (Rev. E) | 2013年 4月 16日 | |
Application note | An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) | PDF | HTML | 2023年 6月 22日 | |
EVM User's guide | 125 MHz 1:4 M-LVDS Repeater with LVCMOS Input Evaluation Board | 2012年 1月 26日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。